ISSCC 2023

2023

200 篇论文 · AI / ML (28) · Power Management (24) · RF & Wireless (20) · Data Converters (15)

ISSCC 2023 Session 17 Data Converters
A 7b 4.5GS/s 4× Interleaved SAR ADC with Fully On-Chip Background Timing Skew Calibration
Yi-Hu Wang, Soon-Jyh Chang
With the development of broadband wireless communication and DSP-based wireline communication, there is a rising demand for medium-resolution (6~8bit) ADCs with multi-gigahertz sampling rates and low power consumption. T
National Cheng Kung University, Tainan, Taiwan
ISSCC 2023 Session 17 Data Converters
A 3mW 2.7GS/s 8b Subranging ADC with Multiple-ReferenceEmbedded Comparators
Jia-Ching Wang, Tai-Haur Kuo
A subranging ADC is a good choice for wideband applications since the numerous comparators for a flash ADC can be avoided [1-5]. However, despite the reduced number of comparators that a subranging ADC requires, these co
National Cheng Kung University, Tainan, Taiwan
ISSCC 2023 Session 17 Data Converters
A Single-Channel 10GS/s 8b >36.4dB SNDR Time-Domain ADC Featuring Loop-Unrolled Asynchronous Successive Approximation in 28nm CMOS
Qian Chen1, Yuan Liang*1, Chirn Chye Boon1, Qing Liu2
Kun Gao Xinxin Technologies, Singapore, Singapore *Equally Credited Authors (ECAs) 1 2 High data throughput and wideband network communications demand high-speed (several to tens of GS/s), moderate-resolution (6-10b) ADC
Nanyang Technological University, Singapore, Singapore
ISSCC 2023 Session 18 Wireless
A W-Band Transceiver Array with 2.4GHz LO Synchronization Enabling Full Scalability for FMCW Radar
Jingzhi Zhang, Ajay Singhvi, Sherif S. Ahmed, Amin Arbabian
Closing the angular resolution gap between CMOS radar and optical imaging systems can enable an entirely new cost-effective radar-centric perception solution, but requires extremely large transceiver (TRX) arrays to achi
Stanford University, Stanford, CA
ISSCC 2023 Session 18 Wireless
A 128Gb/s 1.95pJ/b D-Band Receiver with Integrated PLL and ADC in 22nm FinFET
Abhishek Agrawal1, Amy Whitcombe2, Woorim Shin3, Ritesh Bhat1,
Somnath Kundu1, Peter Sagazio1, Hariprasad Chandrakumar1, Thomas Brown1, Brent Carlton1, Christopher Hull4, Steven Callender1, Stefano Pellerano1 Intel, Hillsboro, OR, 2Intel, Santa Clara, CA, 3now with Apple, Sunnyvale,
ISSCC 2023 Session 18 Wireless
71-to-89GHz 12Gb/s Double-Edge-Triggered Quadrature RFDAC with LO Leakage Suppression Achieving 20.5dBm Peak Output Power and 20.4% System Efficiency
Bingzheng Yang, Zhixian Deng, Huizhen Jenny Qian, Xun Luo
The growing demand of millimeter-wave (mm-wave) wireless transmission leads to the requirement of low-cost, high-efficiency, and multi-Gb/s data-rate wireless systems. Allocated by the Federal Communications Commission (
University of Electronic Science and Technology of China, Chengdu, Chi
ISSCC 2023 Session 18 Wireless
A 4×4 607GHz Harmonic Injection-Locked Receiver Array Achieving 4.4pW/√Hz NEP in 28nm CMOS is beneficial for THz applications as they typically have limited available illumination power.
Ariane De Vroede, Patrick Reynaert
As illustrated in Fig. 18.4.4, the angular resolution of the optical setup depends on two properties: the pixel-beam-separation (PBS) angle φPBS and the half-power beamwidth (HPBW) θHPWB. For the optical setup in Fig. 18
ISSCC 2023 Session 19 Other
An Interferer-Tolerant Harmonic-Resilient Receiver with >+10dBm 3rd-Harmonic Blocker P1dB for 5G NR Applications
Soroush Araei, Shahabeddin Mohin, Negar Reiskarimian
The sub-6GHz spectrum is heavily utilized by 5G New Radio (NR), as well as traditional cellular and WiFi technologies. A major challenge in designing SAW-less wideband radio receivers (especially targeting the sub-2GHz r
Massachusetts Institute of Technology, Cambridge, MA
ISSCC 2023 Session 19 Other
A 2.95mW/element Ka-band CMOS Phased-Array Receiver Utilizing On-Chip Distributed Radiation Sensors in Low-Earth-Orbit Small Satellite Constellation
Xi Fu1, Dongwon You1, Xiaolin Wang1, Michihiro Ide1, Yuncheng Zhang1,
Jun Sakamaki1, Ashibir Aviat Fadila1, Zheng Li1, Yun Wang1, Jumpei Sudo2, Makoto Higaki2, Soichiro Inoue2, Takashi Eishima2, Takashi Tomura1, Jian Pang1, Hiroyuki Sakai1, Kenichi Okada1, Atsushi Shirane1 Tokyo Institute
ISSCC 2023 Session 19 Other
A Small-Satellite-Mounted 256-Element Ka-Band CMOS Phased-Array Transmitter Achieving 63.8dBm EIRP Under 26.6W Power Consumption Using Single/Dual Circular Polarization Active Coupler
Dongwon You , Xi Fu , Xiaolin Wang , Yuan Gao , Wenqian Wang ,
Jun Sakamaki1, Hans Herdian1, Sena Kato1, Michihiro Ide1, Yuncheng Zhang1, Ashbir Aviat Fadila1, Zheng Li1, Chun Wang1, Yun Wang1, Jumpei Sudo2, Makoto Higaki2, Nahoka Kawaguchi2, Masaya Nitta2, Soichiro Inoue2, Takashi
ISSCC 2023 Session 2 Digital Processors
“Zen 4”: The AMD 5nm 5.7GHz x86-64 Microprocessor Core
Benjamin Munger1, Kathy Wilcox1, Jeshuah Sniderman1, Chuck Tung1,
Brett Johnson2, Russell Schreiber3, Carson Henrion2, Kevin Gillespie1, Tom Burd4, Harry Fair1, David Johnson2, Jonathan White1, Scott McLelland1, Steven Bakke1, Javin Olson1, Ryan McCracken1, Matthew Pickett2, Aaron Hori
ISSCC 2023 Session 2 Digital Processors
A 5G Mobile Gaming-Centric SoC with High-Performance Thermal Management in 4nm FinFET
Bo-Jr Huang, Alfred Tsai, Lear Hsieh, Kathleen Chang, C.-J. Tsai,
Jia-Ming Chen, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Jack Ciao, Barry Chen, Chuck Chang, Ping Kao, Ericbill Wang, Harry H. Chen, Hugh Mair, Shih-Arn Hwang MediaTek, Hsinchu, Taiwan In recent years, mobile gaming has grown
ISSCC 2023 Session 2 Digital Processors
Amorphica: 4-Replica 512 Fully Connected Spin 336MHz Metamorphic Annealer with Programmable Optimization Strategy and Compressed-Spin-Transfer Multi-Chip Extension
Kazushi Kawamura*1, Jaehoon Yu*1, Daiki Okonogi1, Satoru Jimbo1,
Genta Inoue1, Akira Hyodo1, Ángel López García-Arias1, Kota Ando2, Bruno Hideki Fukushima-Kimura2, Ryota Yasudo3, Thiem Van Chu1, Masato Motomura1 Tokyo Institute of Technology, Yokohama, Japan, 2Hokkaido University, Sap
ISSCC 2023 Session 2 Digital Processors
A Fully Integrated End-to-End Genome Analysis Accelerator for Next-Generation Sequencing
Yen-Lung Chen*1, Chung-Hsuan Yang*1, Yi-Chung Wu*1, Chao-Hsi Lee2,
Wen-Ching Chen3, Liang-Yi Lin3, Nian-Shyang Chang3, Chun-Pin Lin3, Chi-Shi Chen3, Jui-Hung Hung2,4, Chia-Hsiang Yang1,2 National Taiwan University, Taipei, Taiwan GeneASIC Technologies, Hsinchu, Taiwan 3 Taiwan Semicondu
ISSCC 2023 Session 2 Digital Processors
A 28nm 142mW Motion-Control SoC for Autonomous Mobile Robots
I-Ting Lin1, Zih-Sing Fu1, Wen-Ching Chen2, Liang-Yi Lin2, Nian-Shyang Chang2,
(AMRs) have proven useful for smart factories and have potential to revolutionize critical missions, such as disaster rescue [1]. As illustrated in Fig. 2.5.1, AMRs can perceive the environment, plan for assigned tasks a
Chun-Pin Lin2, Chi-Shi Chen2, Chia-Hsiang Yang1 National Taiwan Univer
ISSCC 2023 Session 2 AI / ML
VISTA: A 704mW 4K-UHD CNN Processor for Video and Image Spatial/Temporal Interpolation Acceleration
Kai-Ping Lin, Jia-Han Liu, Jyun-Yi Wu, Hong-Chuan Liao, Chao-Tsung Huang
Video convolutional neural networks (CNNs) have achieved great success in highresolution imaging applications, such as video super-resolution (VSR) and demonstrated superior quality and temporal consistency by leveraging
National Tsing Hua University, Hsinchu, Taiwan
ISSCC 2023 Session 2 Digital Processors
MetaVRain: A 133mW Real-Time Hyper-Realistic 3D-NeRF Processor with 1D-2D Hybrid-Neural Engines for Metaverse on Mobile Devices
Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Hoi-Jun Yoo
A neural radiance field (NeRF) [1] uses a deep neural network (DNN) to create 3D models by training the DNN to memorize 3D scene geometry from a few photos. Prior work uses conventional computer graphic algorithms, such
Korea Advanced Institute of Science and Technology, Daejeon, Korea
ISSCC 2023 Session 20 Power Management
A High Common-Mode Transient Immunity GaN-on-SOI Gate Driver for High dV/dt SiC Power Switch
Si-Yi Li1, Wei-Chien Hung1, Tz-Wun Wang1, Ya-Ting Hsu1, Ke-Horng Chen1,
Semiconductor, Hsinchu, Taiwan 1 2 Silicon carbide (SiC) MOSFET devices offer better performance in high-voltage (HV) and high-current applications, such as electric vehicles, railways, and motor drives due to their low
Kuo-Lin Zheng1,2, Ying-Hsi Lin3, Shian-Ru Lin3, Tsung-Yen Tsai3 Nation
ISSCC 2023 Session 20 Power Management
A Condition-Adaptive ∆f3-EMI Control GaN Switching Regulator With Modulation Frequency Envelope Tracking For Full-Spectrum Automotive CISPR 25 Compliance
Lixiong Du1, Dong Yan1,2, D. Brian Ma1
Texas Instruments, Dallas, TX 1 2 As the fastest growing sector of global IC market, automotive IC industry advances quickly toward record high levels of electrification, communication, sensing and autonomous driving. A
University of Texas at Dallas, Richardson, TX
ISSCC 2023 Session 20 Power Management
A GaN Gate Driver with On-chip Adaptive On-time Controller and Negative Current Slope Detector
Shu-Yung Lin1, Ssu-Yu Lin1, Sheng-Hsi Hung1, Tz-Wun Wang1, Ching-Ho Li1,
Chang-Lin Go1, Shao-Chang Huang1, Ke-Horng Chen1, Kuo-Lin Zheng1,2, Ying-Hsi Lin3, Shian-Ru Lin3, Tsung-Yen Tsai3 National Yang Ming Chiao Tung University, Hsinchu, Taiwan Chip-GaN Power Semiconductor, Hsinchu, Taiwan 3
ISSCC 2023 Session 20 Power Management
Multiple-Phase Accelerated Current Control in Bidirectional Energy Transfer of Automotive High-Voltage and Low-Voltage Batteries
Tz-Wun Wang1, Si-Yi Li1, Sheng-Hsi Hung1, Tzu-Ying Wu1, Chi-Yu Chen1,
Hsinchu, Taiwan 3 Realtek Semiconductor, Hsinchu, Taiwan 1 2 48V and 12V power supplies play a critical role in electric vehicle (EV) power systems. In general, 48V transfers energy to 12V to supply lidar, camera, sensor
Po-Jui Chiu1, Ke-Horng Chen1, Kuo-Lin Zheng1,2, Ying-Hsi Lin3, Tsung-Y
ISSCC 2023 Session 21 Other
A 65nm CMOS Living-Cell Dynamic Fluorescence Sensor with 1.05fA Sensitivity at 600/700nm Wavelengths
Fatemeh Aghlmand1, Chelsea Hu1,2, Saransh Sharma1, Krishna K. Pochana1,
Richard M. Murray1, Azita Emami1 California Institute of Technology, Pasadena, CA Texas A&M University, College Station, TX 1 2 Integrated, low-cost and miniaturized devices that can detect clinically relevant biomarkers
ISSCC 2023 Session 21 Other
A 22µW Peak Power Multimodal Electrochemical Sensor Interface IC for Bioreactor Monitoring
Qiuyang Lin1, Wim Sijbers1, Christina Avdikou1, Didac Gomez1,2,
The Netherlands 1 2 Bioreactors are employed in many industries like food, beverage, chemical, and biopharmaceutical to grow biologically active compounds. Bioreactors range in size from large industrial tanks for manufa
Dwaipayan Biswas1, Sneha Sneha3, Anastasios Malissovas3, Bernardo Tacc
ISSCC 2023 Session 21 Other
A CMOS Multi-Functional Biosensor Array for Rapid LowConcentration Analyte Detection with On-Chip DEP-Assisted Active Enrichment and Manipulation with No External Electrodes
Dongwon Lee1, Doohwan Jung2, Fuze Jiang1, Gregory Villiam Junek3,
Diego, CA 1 3 Electronic biosensors are transducers that convert biomolecular or cellular information to electronic readouts. Though advances in electronics keep improving biosensors’ performance, often their ultimate de
Jongseok Park4, Hangxing Liu1, Ying Kong1, Youngin Kim1, Jing Wang1, H
ISSCC 2023 Session 21 Other
A 263GHz 32-Channel EPR-on-a-Chip Injection-Locked VCO-Array
Anh Chu*1, Michal Kern*1, Khubaib Khan1, Klaus Lips2, Jens Anders1,3
Helmholtz-Zentrum Berlin für Materialien und Energie, Berlin, Germany 3 Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany *Equally Credited Authors (ECAs) 1 2 Electron paramagnetic resonance (EPR)
University of Stuttgart, Stuttgart, Germany
ISSCC 2023 Session 21 Other
An LTE-Harvesting BLE-to-WiFi Backscattering Chip for Single-Device RFID-Like Interrogation
Shih-Kai Kuo*, Manideep Dunna*, Hongyu Lu, Akshit Agarwal,
Dinesh Bharadia, Patrick P. Mercier University of California, San Diego, CA *Equally Credited Authors (ECAs) Recent work in backscatter modulation has enabled very low-power communication between an IoT tag and commodity
ISSCC 2023 Session 21 Other
ASIL-D Compliant Battery Monitoring IC with High Measurement Accuracy and Robust Communication
Jong-Kyoung Lee1,2, Sunsik Woo2, Wooyoung Jeong2, Kwang-Seok Oh2,
Donghyeon Kim2, Youngwoon Ko2, Jin-Yong Jeon2, Jooho Lee2, Young-Suk Son2, Sang-Gug Lee1, Kyeongha Kwon1 Korea Advanced Institute of Science and Technology, Daejeon, Korea Autosilicon, Daejeon, Korea 1 2 Electric vehicle
ISSCC 2023 Session 22 Other
A 12.4TOPS/W @ 136GOPS AI-IoT System-on-Chip with 16
RISC-V, 2-to-8b Precision-Scalable DNN Acceleration and, 30%-Boost Adaptive Body Biasing
Francesco Conti1, Davide Rossi1, Gianna Paulin2, Angelo Garofalo1, Alfio Di Mauro2, Georg Rutishauer2, Gianmarco Ottavi1, Manuel Eggimann2, Hayate Okuhara1, Vincent Huard3, Olivier Montfort3, Lionel Jure3, Nils Exibard3,
ISSCC 2023 Session 22 Other
A 28nm 2D/3D Unified Sparse Convolution Accelerator with Block-Wise Neighbor Searcher for Large-Scaled Voxel-Based Point Cloud Network
Wenyu Sun1, Xiaoyu Feng1, Chen Tang1, Shupei Fan1, Yixiong Yang1,
important role in many emerging applications such as autonomous driving, visual navigation and virtual reality. Recent research shows that adopting 3D voxel-based sparse convolution (SCONV) as a backbone can achieve bett
Jinshan Yue2, Huazhong Yang1, Yongpan Liu1 Tsinghua University, Beijin
ISSCC 2023 Session 22 AI / ML
A 127.8TOPS/W Arbitrarily Quantized 1-to-8b ScalablePrecision Accelerator for General-Purpose Deep Learning
with Reduction of Storage, Logic and Latency Waste
deep learning accelerators has focused on inference tasks to improve performance by means of maximally utilizing sparsity and quantization. Unlike CNN-only networks, however, recent state-of-the-art (SOTA) models consist
Seunghyun Moon1, Han-Gyeol Mun1, Hyunwoo Son2, Jae-Yoon Sim1 Pohang Un
ISSCC 2023 Session 22 Other
A 28nm 11.2TOPS/W Hardware-Utilization-Aware Neural-Network Accelerator with Dynamic Dataflow
Cheng-Yan Du1, Chieh-Fu Tsai2, Wen-Ching Chen3, Liang-Yi Lin3,
Research Institute, Hsinchu, Taiwan 1 With the rapid evolution of AI technology, various neural network structures have been developed for diverse applications. As a typical ease, Fig. 22.4.1 shows that the convolution (
Nian-Shyang Chang3, Chun-Pin Lin3, Chi-Shi Chen3, Chia-Hsiang Yang1 Na
ISSCC 2023 Session 22 AI / ML
C-DNN: A 24.5-85.8TOPS/W Complementary-Deep-NeuralNetwork Processor with Heterogeneous CNN/SNN Core Architecture and Forward-Gradient-Based Sparsity Generation
Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Donghyeon Han, Hoi-Jun Yoo
have been shown to achieve the same accuracy as Convolutional-Neural-Networks (CNNs). By using CNN-to-SNN conversion, SNNs become a promising candidate for ultra-low power AI applications [1]. For example, compared to BN
Korea Advanced Institute of Science and Technology, Daejeon, Korea Spi
ISSCC 2023 Session 22 AI / ML
ANP-I: A 28nm 1.5pJ/SOP Asynchronous Spiking Neural Network Processor Enabling Sub-0.1µJ/Sample On-Chip Learning for Edge-AI Applications
Jilin Zhang1, Dexuan Huo1, Jian Zhang1, Chunqi Qian1, Qi Liu1, Liyang Pan1,
With the development of on-chip learning processors for edge-AI applications, energy efficiency of NN inference and training is more and more critical. As on-chip training energy dominates the energy consumption of edge-
Zhihua Wang1, Ning Qiao2, Kea-Tiong Tang3, Hong Chen1 Tsinghua Univers
ISSCC 2023 Session 22 Other
DL-VOPU: An Energy-Efficient Domain-Specific Deep-LearningBased Visual Object Processing Unit Supporting Multi-Scale Semantic Feature Extraction for Mobile Object Detection/Tracking Applications
Yuchuan Gong, Teng Zhang, Hongtao Guo, Xiyuan Liu, Jingxiao Zheng,
years, deep learning-based visual object detection/tracking (VODT) has been widely used in intelligent applications such as autonomous driving, UAV, smart robot and VR/AR. As general AI hardware platforms, GPUs and gener
Hongqiang Wu, Conghan Jia, Luying Que, Liang Zhou, Liang Chang, Jun Zh
ISSCC 2023 Session 22 Other
A 0.81mm2 740µW Real-Time Speech Enhancement Processor Using Multiplier-Less PE Arrays for Hearing Aids in 28nm CMOS
Sungjin Park, Sunwoo Lee, Jeongwoo Park, Hyeong-Seok Choi, Dongsuk Jeon
Speech enhancement (SE) is a task to improve voice quality and intelligibility by removing noise from the audio, which is widely adopted in hearing assistive devices. Hearing aids are generally worn in or behind the ear,
Seoul National University, Seoul, Korea
ISSCC 2023 Session 22 AI / ML
A 12nm 18.1TFLOPs/W Sparse Transformer Processor with
Entropy-Based Early Exit, Mixed-Precision Predication and, Fine-Grained Power Management
Thierry Tambe1, Jeff Zhang1, Coleman Hooper1, Tianyu Jia2, Paul N. Whatmough1,3, Joseph Zuckerman4, Maico Cassel Dos Santos4, Erik Jens Loscalzo4, Davide Giri4, Kenneth Shepard4, Luca Carloni4, Alexander Rush5, David Bro
ISSCC 2023 Session 23 Analog Circuits
A 7.9fJ/Conversion-Step and 37.12aFrms Pipelined-SAR Capacitance-to-Digital Converter with kT/C Noise Cancellation and Incomplete-Settling-Based Correlated Level Shifting
Jihang Gao1, Linxiao Shen1, Heyi Li1, Siyuan Ye1, Jie Li1, Xinhang Xu1, Jiajia Cui1,
sensor applications, capacitive sensors are widely used to convert various capacitances into digital signals, and the demand for power-efficient high-resolution capacitance-to-digital converters (CDCs) is on the rise. In
Yunhung Gao1, Ru Huang1, Le Ye1,2 Peking University, Beijing, China Ad
ISSCC 2023 Session 23 Analog Circuits
A 40A Shunt-Based Current Sensor with ±0.2% Gain Error from -40°C to 125°C and Self-Calibration
Zhong Tang1, Nandor G. Toth1, Roger Zamparette1, Tomohiro Nezuka2,
Yoshikazu Furuta2, Kofi A. A. Makinwa1 Delft University of Technology, Delft, The Netherlands MIRISE Technologies, Aichi, Japan 1 2 Low-cost metal (e.g., PCB trace) shunts can be used to make accurate current sensors (<1
ISSCC 2023 Session 23 Analog Circuits
A 51A Hybrid Magnetic Current Sensor with a Dual Differential DC Servo Loop and 43mArms Resolution in a 5MHz Bandwidth
Amirhossein Jouyaeian1, Qinwen Fan1, Mario Motz2, Udo Ausserlechner2, Kofi A. A. Makinwa1
Each quadrature component is chopper demodulated and then integrated via Rs3 (=10M&) and Cfsp (=5pF) to generate a correction signal that is upmodulated and fed back to A4 via an auxiliary input stage. The offset of A4 i
Delft University of Technology, Delft, The Netherlands Infineon Techno
ISSCC 2023 Session 23 Analog Circuits
A Closed-Loop 12bit CMOS-Integrated Stress Sensor System with 4bit Adjustable Sensitivity from 178 to 11kPa/LSB at up to 22.5kS/s and 5bit Dynamic Range Adjustment.
Kim Allinger1, Matthias Kuhl2
University of Freiburg - IMTEK, Freiburg, Germany 1 2 The increasing popularity of integrated stress sensors due to emerging fields such as Internet-of-Things (IoT), robotics and predictive maintenance led to various imp
Hamburg University of Technology, Hamburg, Germany
ISSCC 2023 Session 23 Analog Circuits
A Sub-1V 810nW Capacitively-Biased BJT-Based Temperature Sensor with an Inaccuracy of ±0.15°C (3σ) from -55°C to 125°C
Zhong Tang1, Sining Pan1,2, Kofi A. A. Makinwa1
Tsinghua University, Beijing, China 1 2 BJT-based temperature sensors are widely used because they can achieve excellent accuracy after 1-point calibration. However, they typically dissipate µWs of power and require supp
Delft University of Technology, Delft, The Netherlands
ISSCC 2023 Session 23 Analog Circuits
A 2.98pJ/conversion 0.0023mm2 Dynamic Temperature Sensor with Fully On-Chip Corrections
Yuting Shen, Hanyue Li, Eugenio Cantatore, Pieter Harpe
Nowadays, many battery-operated SoCs for IoT and environmental monitoring applications are equipped with temperature sensors. In these miniaturized systems, power and area are two critical concerns. One challenge for tem
Eindhoven University of Technology, Eindhoven, The Netherlands
ISSCC 2023 Session 23 Analog Circuits
A BJT-Based Temperature Sensor with ±0.1°C (3σ) Inaccuracy from -55°C to 125°C and a 0.85pJ∙K2 Resolution FoM Using Continuous-Time Readout
Nandor G. Toth*1, Zhong Tang1, Teruki Someya1,3, Sining Pan*1,2, Kofi A. A. Makinwa1
temperature sensors are widely used due to their high accuracy over a wide temperature range with a low-cost 1-point trim. Although resistor-based sensors can achieve better energy efficiency, they typically require a 2-
Delft University of Technology, Delft, The Netherlands Tsinghua Univer
ISSCC 2023 Session 24 mm-Wave
A 0.64-to-0.69THz Beam-Steerable Coherent Source with 9.1dBm Radiated Power and 30.8dBm Lensless EIRP in 65nm CMOS
Liang Gao, Chi Hou Chan
Si-based compact terahertz (THz) integrated systems have been successfully demonstrated in imaging, spectroscopy, high-speed data transmission, and radar applications in the low-THz band [1]. A THz signal source is indis
City University of Hong Kong, Hong Kong, China
ISSCC 2023 Session 24 mm-Wave
A 200-to-350GHz SiGe BiCMOS Frequency Doubler with Slotline-Based Mode-Decoupling Harmonic-Tuning Technique Achieving 1.1-to-4.7dBm Output Power
Shuyang Li1, Xingcun Li1,2, Huibo Wu1, Wenhua Chen1
Sanechips Technology, Shenzhen, China 1 2 Silicon-based ultra-broadband terahertz (THz) generation has attracted growing interest in recent years, as it provides a low-cost and high-integration solution for high-resoluti
Tsinghua University, Beijing, China
ISSCC 2023 Session 25 RF & Wireless
A 4.1W Quadrature Doherty Digital Power Amplifier with 33.6% Peak PAE in 28nm Bulk CMOS
Jiaxiang Li1, Yun Yin1, Hang Chen2, Jie Lin1, Yicheng Li1, Xianglong Jia1,
and higher output-power requirements, especially at the base station side. As shown in Fig. 25.1.1, compared to the traditional analog-transmitter architectures with high-power GaAs/GaN poweramplifier (PA) modules, digit
Zhen Hu1, Xiuyin Zhang2, Hongtao Xu1 Fudan University, Shanghai, China
ISSCC 2023 Session 25 RF & Wireless
A 19.7-to-43.8GHz Power Amplifier with Broadband Linearization Technique in 28nm Bulk CMOS
Weisen Zeng1, Li Gao1, Ningzheng Sun1, Hongtao Xu2, Quan Xue1, Xiuyin Zhang1
Fudan University, Shanghai, China 1 2 5G mm-wave systems in the frequency-range-2 (FR2) band (ranging from 24.25 to 43.5GHz) are expected to provide multi-gigabit-per-second (mGb/s) data-rates. Different FR2 bands are em
South China University of Technology, Guangzhou, China
ISSCC 2023 Session 25 RF & Wireless
A 4b RFDAC at 8GS/s for FMCW Chirps with 4GHz Bandwidth in 10µs
Soumya Krishnapuram Sireesh1,2, Sanaz Hadipour Abkenar1,2,
Niels Christoffers1, Christoph Wagner1, Thorsten Brandt1, Andreas Stelzer2 Infineon Technologies, Linz, Austria Johannes Kepler University, Linz, Austria 1 2 A frequency-modulated continuous-wave (FMCW) radar is highly r
ISSCC 2023 Session 25 RF & Wireless
A 1-to-5GHz All-Passive Frequency-Translational 4th-Order N-path Filter with Low-Power Clock Boosting for High Linearity and Relaxed Pdc-Frequency Trade-Off to the LO overlap while using 2× higher-duty-cycle clocks, thereby enabling a 4 to 5× higher operating frequency compared to higher-order N-path filters [1-5]. These inductors do not limit tuning range at all, unlike the coupling inductors in prior higherorder N-path topologies.
Aravind Nagulu1, Mingyu Yi 1, Yi Zhuang1, Sasank Garikapati2, Harish Krishnaswamy2
The higher-order N-path filter was designed to operate from 1 to 5GHz. The three capacitors CF, CG, and CB of the baseband elliptical-LPF loads are designed with a 5b control to program the bandwidth, selectivity, and OO
ISSCC 2023 Session 26 Medical & Bio
A Source-Driver IC Including Power-Switching Fast-Slew-Rate Buffer and 8Gb/s Effective 3-Tap DFE Receiver Achieving 4.9mV DVRMS and 17V/µs Slew Rate for 8K Displays and Beyond
Kyungho Ryu*, Ji-Yong Jeong*, Jung-Pil Lim, Kil-Hoon Lee, Kyongho Kim,
and faster refresh rate displays, the nextgeneration TVs and gaming monitors are expected to accommodate 8K resolution with a refresh rate of 120Hz and beyond. In such display systems, about one thousand channels will be
Yongil Kwon, Seongjong Yoo, Siwoo Kim, Hyun-Wook Lim, Jae-Youl Lee Sam