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JSSC 2006第5期mm-Wave0.18-μm SiGe-BiCMOS

Shielded Passive Devices for Silicon-Based Monolithic Microwave and Millimeter-Wave

介绍了一种用于硅基单片微波和毫米波的无源器件屏蔽技术,显著提升性能。
Q-factor 25-35 (15-40 GHz), 7.4-nH电感峰值Q 32, 21-26 GHz PA 23-dBm输出
浮动屏蔽硅基无源器件毫米波CMOSBiCMOS
创新点1:浮动屏蔽技术减少损耗(方法创新):通过引入浮动屏蔽技术,显著降低了片上传输线、电感和变压器的损耗,实验表明在15至40 GHz频率范围内,屏蔽共面波导的Q因子提高了2倍以上。
创新点2:无需显式接地连接(电路创新):浮动屏蔽技术无需显式接地连接,简化了电路设计,同时提高了电路的灵活性和集成度,适用于现有的深亚微米硅工艺。
创新点3:兼容现有深亚微米硅工艺(系统创新):浮动屏蔽技术的实现与当前和未来的深亚微米硅工艺设计约束完全兼容,无需工艺修改,便于大规模生产应用。
创新点4:高性能应用实例(系统创新):在0.18-μm SiGe-BiCMOS工艺中实现了浮动屏蔽被动元件,包括21-26 GHz功率放大器和17 GHz WLAN图像抑制接收器MMIC,展示了其在高频应用中的优异性能。
Abstract
This paper introduces floating shields for on-chip transmission lines, inductors, and transformers implemented in production silicon CMOS or BiCMOS technologies. The shield minimizes losses without requiring an explicit on-chip ground connection. Experimental measurements demonstrate -factor ranging from 25 to 35 between 15 and 40 GHz for shielded coplanar waveguide fabricated on 10 /10 cm silicon. This is more than a factor of 2 improvement over conventional on-chip transmission lines (e.g., microstrip, CPW). A floating-shielded, differentially driven 7.4-nH inductor demonstrates a peak of 32, which is 35% higher than an unshielded example. Similar results are realizable for on-chip transformers. Floating-shielded bond- pads with 15% less parasitic capacitance and over 60% higher shunt equivalent resistance compared to conventional shielded bondpads are also described. Implementation of floating shields is compatible with current and projected design constraints for production deep-submicron silicon technologies without process modifications. Application examples of floating-shielded passives implemented in a 0.18- m SiGe-BiCMOS are presented, including a 21–26-GHz power amplifier with 23-dBm output at 20% PAE (at 22 GHz), and a 17-GHz WLAN image-reject receiver MMIC which dissipates less than 65 mW from a 2-V supply.