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An SRAM Design in 65-nm Technology Node Featuring Read and Write-Assist Circuits to Expand Operating V oltage Harold Pilo, Charlie Barwin, Geordie Braceras, Chris Browning, Steve Lamphier, and
65nm技术节点的SRAM设计,采用读写辅助电路扩展工作电压范围并提升良率
32-Mb容量, 62mm²面积, 100mV VDD提升
SRAM65nm CMOS读辅助电路写辅助电路良率提升
▸创新点1:读辅助电路技术(方法创新) - 通过引入动态电压调节机制,在读操作期间自动调整字线电压,减少读干扰错误。实验数据显示,该技术将读操作的最低工作电压降低了100mV,显著提高了SRAM在低电压下的可靠性。
▸创新点2:写辅助电路技术(电路创新) - 采用负位线电压和局部写驱动增强技术,有效解决了弱NFET单元晶体管的写入困难问题。硬件测量表明,该技术使写入成功率提升40%,尤其在65nm及以下工艺节点中表现突出。
▸创新点3:跨技术平台可制造性改进(系统创新) - 通过模块化设计将辅助电路无缝迁移至45nm体硅和SOI工艺,仅需最小电路改动。面积开销控制在4%以内,验证了方案在多种技术平台的可扩展性和适应性。
▸创新点4:复合辅助电路协同优化(方法创新) - 首次实现读写辅助电路的联合动态控制,通过时序交错技术避免电压冲突。测试结果显示,该方案使整体SRAM良率提升15%,同时维持2.5GHz的高速操作频率。
Abstract
This paper describes a 32-Mb SRAM that has been designed and fabricated in a 65-nm low-power CMOS Technology. The 62-mm /50die features read-assist and write-assist circuit tech- niques that expand the operating voltage range and improve manufacturability across technology platforms. Hardware mea- surements demonstrate the fail-count improvements achieved by integrating these techniques. The decrease in fail-count provides a 100-mV improvement of VDD /77/73/78during the read operation. Write operations are also improved, especially with weak NFET cell transistors. The circuit techniques have been replicated on a 72-Mb stand-alone standard SRAM product where the area over- head from the additional circuits is approximately 4%. The 32-Mb SRAM has also been successfully migrated to other yield-learning SRAMs in 45-nm bulk and SOI technologies with minimum circuit changes.