← 返回 JSSC 论文列表JSSC 2007第10期RF & Wireless130nm
Low-Power Circuits for a 2.5-V , 10.7-to-86-Gb/s Serial Transmitter in 130-nm SiGe BiCMOS
130nm SiGe BiCMOS工艺下实现86 Gb/s低功耗串行发射器电路
130nm SiGe BiCMOS, 2.5V, 86 Gb/s (最高92 Gb/s@0°C)
低功耗串行发射器SiGe BiCMOS高速逻辑电感峰值
▸采用真正BiCMOS高速逻辑族降低电源电压
▸通过权衡尾电流与电感峰值降低电流消耗
▸2.5V供电电压为同类硅基技术中最低
Abstract
Low-power building blocks for a serial transmitter operating up to 86 Gb/s are designed and implemented in a 130-nm SiGe BiCMOS technology with 150-GHz SiGe HBT. Design techniques are presented which aim to minimize high-speed building block power consumption. They include lowering the supply voltage by employing a true BiCMOS high-speed logic family, as well as reducing current consumption by trading off tail currents for inductive peaking. A serial transmitter testchip consuming under 1 W is fabricated and operation is verified up to 86 Gb/s at room temperature (92 Gb/s and 71 Gb/s at 0 C and 100 C, respectively). The circuit operates from a 2.5-V supply voltage, which is the lowest supply voltage for circuits at this data rate in silicon technologies reported to date.