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JSSC 2007第10期Power Management0.2μm SiGe BiCMOS

A 3.3 V 12.5 Gb/s 0.2/22m SiGe BiCMOS Laser Diode Driver Using Bias Current

采用0.2μm SiGe BiCMOS工艺实现低功耗12.5Gb/s激光二极管驱动IC。
3.3V, 12.5Gb/s, 20-100mA调制电流, 1-100mA偏置电流
激光二极管驱动低功耗SiGe BiCMOS动态射极跟随器RC补偿网络
创新点1:采用3.3V电源电压,显著降低功耗,相比现有驱动器功耗减少三倍,适用于低功耗应用场景。
创新点2:引入动态射极跟随器,通过局部正反馈环路增强驱动能力,无需额外电源功率,提升输出开关的关断速度。
创新点3:使用RC补偿网络,有效减少信号路径的峰值和振铃,通过临界阻尼技术优化大负载电容和输出开关寄生LC电路的性能。
创新点4:采用偏置调制消除电路和级联电流发生器,实现偏置和调制电流的直接片上求和,简化电路设计并提高集成度。
Abstract
A low supply voltage fully-integrated 12.5 Gb/s laser diode driver IC was realized in a 0.2 m 60 GHz SiGe BiCMOS process. A three-fold power consumption reduction versus existing drivers was achieved by using a 3.3 V supply and a dynamic emitter follower having a local positive feed- back loop that boosts the drive strength of the leg that controls the turning-off output switch, without taking additional supply power. Low voltage operation was achieved by replacing the tail current source of the output switch with a resistor and setting the current value with a common-mode feedback loop. A direct on-chip summation of bias and modulation currents was realized by using a bias modulation canceling circuit and a cascode current generator with series damping resistor. The signal path peaking and ringing was reduced with RC compensation networks that critically damp both the last emitter follower which drives a large load capacitance and the output switch parasitic LC circuit. A virtually constant dynamic performance was achieved for a wide range of modulation currents by using adjustable voltage swings and tail currents in the driver back-end stages. Laser diode driver IC specifications include: 3–3.6 V supply voltage, 70 mA supply current (excluding output current), 20–100 mA modulation cur- rent range, 1–100 mA bias current range, 12 ps/112/112deterministic jitter, 25 ps rise/fall time, 10% to 90% pulsewidth adjustment and 1.5 1.5 mm/50die area.