← 返回 JSSC 论文列表JSSC 2007第11期Power Management0.35微米Buck Converter
Stacked-Chip Implementation of On-Chip Buck Converter for Distributed Power Supply System in SiPs
提出了一种采用堆叠芯片实现的片上降压转换器，适用于分布式电源系统，首次实验验证了3D堆叠转换器的运行。
62%最大功率效率，70mA输出电流，0.7电压转换比，200MHz开关频率
片上降压转换器3D芯片堆叠分布式电源系统功率效率CMOS工艺
▸采用3D芯片堆叠技术实现片上降压转换器
▸使用玻璃环氧中介层提高效率至71.3%
▸在0.35微米CMOS工艺上实现
Abstract
An on-chip buck converter which is implemented by stacking chips and suitable for on-chip distributed power supply systems is proposed. The operation of the converter with 3-D chip stacking is experimentally verified for the first time. The manufac- tured converter achieves a maximum power efficiency of 62% for an output current of 70 mA and a voltage conversion ratio of 0.7 with a switching frequency of 200 MHz and a 2 2 mm on-chip LC output filter. The active part and the passive LC output filter are implemented on separate chips fabricated in 0.35- m CMOS and connected with metal bumps. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3% is also dis- cussed.