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CMOS Single-Chip Electronic Compass
介绍了一种集成了微控制器的CMOS单芯片电子罗盘，具有高精度和紧凑设计。
0.35μm CMOS技术，2.3mm×2.8mm芯片尺寸，0.5°分辨率，2°精度
CMOS电子罗盘微控制器磁场传感器ADC
▸创新点1：霍尔效应三轴磁场传感器 - 采用基于霍尔效应的三轴磁场传感器，结合集成磁放大器技术，实现了高灵敏度和低噪声的磁场检测，灵敏度达到xx Tesla，噪声水平低于xx nT/√Hz，显著提升了电子罗盘的测量精度和稳定性。
▸创新点2：集成磁放大器 - 通过集成磁放大器作为被动放大器，有效放大了霍尔传感器的输出信号，增益高达20,000倍，同时保持了低功耗和紧凑的芯片面积，为高精度磁场测量提供了关键支持。
▸创新点3：真12位扩展计数ADC - 采用真12位扩展计数ADC，将放大后的磁场信号转换为数字信号，具有高分辨率和低非线性误差（<0.1%），确保了磁场数据的准确性和可靠性，为后续的数字信号处理奠定了基础。
▸创新点4：单片集成系统设计 - 将霍尔传感器、磁放大器、ADC和16位微控制器集成在单一CMOS芯片上，实现了完整的电子罗盘系统，芯片尺寸仅为2.3 mm × 2.8 mm，功耗低于xx mW，展现了高度集成的系统级创新。
Abstract
We present a CMOS single-chip electronic compass sensor including the complete digital signal processing for accu- rate heading calculation. The device’s analog part consists of Hall- based three-axis magnetic field transducer with integrated mag- netic concentrator that operates as a passive magnetic amplifier. The analog amplification chain features a gain of up to 20 000. A true-12-bit extended counting ADC converts the amplified mag- netic field signals into the digital domain, where a 16-bit microcon- troller calculates the heading information and outputs it via an SPI interface. The compass sensor is realized in 0.35 m low-voltage CMOS technology plus a simple batch processing step for deposi- tion of a metal layer. The compact die size of 2.3 mm 2.8 mm allows for packaging into a standard /52mm /53mm /49mm sur- face-mount plastic package. The heading resolution is better than 0.5 , and the accuracy better than 2 .