← 返回 JSSC 论文列表JSSC 2008第1期RF & Wireless0.13μm
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities
基于电容耦合的无线互连方案为3D系统集成提供单向和双向传输能力
1.7 GHz时钟信号传输, 420 ps传播延迟, 22 Mb/s吞吐量, 0.08 pJ/b能耗
3D集成电容耦合无线互连低功耗CMOS
▸创新点1：电容耦合无线互连技术，通过电极耦合实现芯片间垂直信号传输，支持1.7 GHz时钟信号和22 Mb/s吞吐量，显著提升3D系统集成性能。
▸创新点2：低功耗RX-TX电路设计，优化电路结构以降低功耗，实现0.08 pJ/b的能效，适用于高密度集成系统。
▸创新点3：利用CMOS工艺中的不同电压阈值，通过标准晶体管的多阈值设计，增强电路功能性和灵活性，提升系统整体性能。
▸创新点4：芯片面对面组装技术，采用0.13μm CMOS工艺，实现高密度集成，减少信号传输延迟至420 ps，提高系统响应速度。
Abstract
A wireless interconnection scheme based on capaci-
tive coupling provides mono- and bi-directional transmission ca-
pabilities for 3-D system integration. Chips are implemented in
0.13
m CMOS technology and assembled face-to-face at die-level.
RX-TX circuits are specifically designed for low-power function-
ality and the implementation takes advantage of the two different
voltage thresholds that are available for the standard transistors in
the CMOS process we used. The communication circuits are