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JSSC 2008第1期RF & Wireless0.8μmSRAM

UHF RFCPUs on Flexible and Glass Substrates for Secure RFID Systems Yoshiyuki Kurokawa, Takayuki Ikeda, Masami Endo, Hiroki Dembo, Daisuke Kawae, Takayuki Inoue, Munehiro Kozuma, Daisuke Ohgarane, Satoru Saito, Koji Dairiki, Hidekazu Takahashi, Yutaka Shionoiri, Tomoaki Atsumi, Takeshi Osada, Kei Takahashi, Takanori Matsuzaki, Hiroyuki Takashina, Yoshinari Yamashita, and

开发了基于柔性基板和玻璃基板的UHF RFCPU,用于安全RFID系统,集成8位CPU和加密功能。
0.8μm设计规则,1.5V电源电压,0.54mW功耗,43cm通信范围
RFIDUHF柔性基板玻璃基板DES加密
采用柔性基板和玻璃基板实现RFIC标签
集成单DES加密和抗侧信道攻击固件
数字控制时钟生成器和两相非重叠时钟方案
Abstract
A radio frequency integrated circuit (RFIC) tag consisting of an 8 bit CPU, a 4 kB ROM, a 512B SRAM, and an RF circuit, which communicates using 915 MHz UHF RF signals, has been developed on both a flexible substrate and a glass substrate. Each of the RFIC tags employs a single DES and an anti-side channel attack routine in firmware for secured communication, and occupies an area of 10.5 mm in width and 8.9 mm in height. The RFIC tag on the flexible substrate is 145 m thick and weighs 262 mg, and the RFIC tag on the glass substrate consumes 0.54 mW at a power supply voltage of 1.5 V and communicates with a maximum range of 43 cm at a power of 30 dBm. The high-performance poly-silicon TFT technology on flexible substrate and glass substrate of 0.8 m design rule, and a gate plus one metal layer are used for fabrication. The RFIC tag realizes stable internal clock generation and distribution by a digital control clock generator and a two-phase nonoverlap clock scheme, respectively.