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JSSC 2008第4期Memory65nmSRAM

A Sub-600-mV , Fluctuation Tolerant 65-nm CMOS SRAM Array With Dynamic Cell Biasing Azeez J. Bhavnagarwala , Member , IEEE

提出一种动态偏置技术,提升65nm CMOS SRAM阵列的抗波动能力。
65nm CMOS, 0.54V/0.38V/0.50V, 10%-12%面积开销
CMOS SRAM动态偏置波动容忍65nm漏电流
创新点1:动态单元偏置技术(方法创新) - 通过动态调整SRAM单元的终端电压,显著提升单元对随机波动的免疫力,降低工作电压至0.54V(单电源)和0.38V/0.50V(双电源),同时减少漏电流50%以上。
创新点2:读写不对称设计(电路创新) - 利用读写操作的不对称性优化单元偏置电压,使SRAM在低电压下仍能保持稳定的读写性能,性能损失仅5%。
创新点3:低功耗与面积优化(系统创新) - 在65nm PDSOI CMOS工艺下实现9kb SRAM阵列,面积开销仅10%-12%,同时显著降低功耗和漏电流。
创新点4:ABIST集成(测试创新) - 集成内置自测试(ABIST)功能,便于在低电压条件下验证SRAM的可靠性和波动容忍能力。
Abstract
Fluctuation limitations on scaling CMOS SRAM cell transistor dimensions and operating voltages are demonstrated by measuring local stochastic distributions of 65-nm PDSOI CMOS SRAM cell storage node voltages during Read, Write, and Reten- tion modes of operation. These measurements reveal insights into terminal voltage dependencies of cell margin distributions—obser- vations that are engaged to increase cell immunity to random /86/84 fluctuations by several orders of magnitude by biasing the cell ter- minal voltages dynamically with a Read-Write asymmetry. Com- binations of circuit techniques implementing these dynamic cell biasing schemes are demonstrated in a 9kb 74b PDSOI CMOS SRAM array with a conventional 65 nm SRAM cell and an ABIST. Measurements demonstrate these techniques to enable /86/77/73/78re- ductions of over 200 mV—lowering measured /86/77/73/78to 0.54 V and 0.38 V/0.50 V for single and dual implementations, respectively. The techniques consume a 10%–12% overhead in area, impact performance marginally ( 5%) and also enable over 50% reduc- tion in cell leakage.