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Alignment-Independent Chip-to-Chip Communication for Sensor Applications Using P
提出一种基于电容耦合的传感器数据读取方法，适用于亚毫米级微型传感器节点。
0.13μm CMOS, 15%数据率差异
电容耦合微型传感器数据读取对齐检测低功耗
▸创新点1：电容耦合数据读取方法创新，通过电容耦合实现传感器芯片与数据读取芯片之间的通信，无需物理连接，适用于微型传感器节点。
▸创新点2：对齐检测与焊盘重配置机制系统创新，实现了无需精确定位的便捷读取，显著提升了系统的实用性和灵活性。
▸创新点3：同时供电与信号传输电路创新，数据读取芯片在接收信号的同时向传感器芯片供电，实现了被动操作，降低了功耗。
▸创新点4：采用0.13μm CMOS工艺制造测试芯片，硅测量结果显示，无论传感器芯片如何随机放置，数据速率差异仅为15%，验证了系统的鲁棒性。
Abstract
, IEEE, Dennis Sylvester , Senior Member , IEEE, and David Blaauw , Senior Member , IEEE
Abstract—We propose a capacitive coupling based method for
sensor data retrieval that can be easily integrated with miniature
sensor nodes of sub-mm scale. T o enable passive operation of the
sensor chip, the data retrieval chip sends power to/receives signal
from the sensor chip simultaneously. An alignment detection and
pad reconfiguration mechanism is implemented to allow conve-
nient read-out without prec