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JSSC 2009第4期Memory45nm

Process Temperature and Supply-Noise Tolerant 45 nm Dense Cache Arrays With Diff

本文提出了一种新型WLUD电路和DVC方案,解决了密集末级缓存中DNF SRAM单元的稳定性问题。
45nm CMOS, 动态电压崩溃(DVC)方案
SRAM缓存稳定性动态电压崩溃工艺容差
WLUD电路创新:通过字线欠驱动(WLUD)技术解决DNF SRAM单元读取稳定性问题,采用动态电压调节机制,在45nm工艺下实现20%的电压容差,显著提升工艺温度和电源噪声容忍度(方法创新)
DVC方案创新:动态电压崩溃(DVC)技术通过动态调整单元保持电压与写入电压的比值,在低压环境下以牺牲部分保持裕度为代价,换取写入稳定性的显著提升(电路创新)
P-cell结构创新:采用pMOS传输管和预充电位线设计,通过无扩散凹槽的nMOS下拉管尺寸优化实现固有比率化读取,相比传统单元提升15%的读取裕度(器件创新)
系统级协同优化:联合WLUD与DVC技术,在测试芯片中验证了M-cell在0.9-1.3V宽电压范围内的稳定工作,同时P-cell通过pMOS强度、nMOS尺寸和DVC参数的协同设计获得低压工作窗口(系统创新)
Abstract
Multi-Vcc Circuits Muhammad Khellah, Member , IEEE, Nam Sung Kim , Senior Member , IEEE , Yibin Ye, Dinesh Somasekhar, Member , IEEE, Tanay Karnik , Senior Member , IEEE , Nitin Borkar, Gunjan Pandya, Member , IEEE, Fatih Hamzaoglu , Member , IEEE, Tom Coan, Yih Wang , Member , IEEE, Kevin Zhang, Senior Member , IEEE, Clair Webb , Member , IEEE, and Vivek De , Senior Member , IEEE Abstract—This paper addresses the stability problem of diffu- sion-notch-free (DNF) SRAM cells used in dense last l