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JSSC 2010第5期RF & Wireless45nm

Effect of Substrate Contact Shape and Placement on RF Characteristics of 45 nm L

研究45nm CMOS器件衬底接触形状和布局对射频特性的影响。
45nm CMOS, 20GHz
最大振荡频率噪声功率增益射频CMOS衬底电阻
揭示了衬底电阻与器件边缘到衬底接触环距离的强相关性
分析了衬底接触环边数对射频性能的影响
阐明了不同频率下衬底电阻对单向增益的作用机制
Abstract
sus A. del Alamo , Fellow, IEEE, Susan L. Sweeney, Jing Wang, and Basanth Jagannathan Abstract—The substrate resistance of 45 nm CMOS devices shows a strong dependence on the distance between the device edge and the substrate contact ring, as well as on the number of sides that the surrounding ring contacts the substrate. We find that the unilateral gain is impacted by the substrate resistance /40/82/115/120/41through the gate-body capacitance feedback path at low to medium frequencies ( 20 GHz)