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A 40 nm 16-Core 128-Thread SPARC SoC Processor Jinuk Luke Shin
40纳米16核128线程SPARC SoC处理器,支持512线程系统,集成6MB L2缓存和高速I/O。
40nm工艺, 1.0V, 2.4Tb/s SerDes I/O
SPARC多核处理器高带宽电源管理SoC
▸创新点1:16核128线程设计 - 采用16个8线程SPARC核心的SoC架构,通过多线程技术显著提升并行处理能力,相比前代产品线程数量翻倍,适用于高吞吐量计算场景。
▸创新点2:512线程系统扩展能力 - 通过无胶合(glueless)扩展技术支持多达512线程的4路系统配置,增强了多芯片协同工作的灵活性和可扩展性,满足高性能计算需求。
▸创新点3:6MB L2缓存和高速I/O支持 - 集成16Bank 6MB L2缓存和512 GB/s分层交叉开关,结合312通道SerDes I/O(2.4 Tb/s带宽),为多线程提供充足数据吞吐能力,优化内存访问延迟。
▸创新点4:多时钟域与电源域优化 - 采用动态时钟和电源域划分技术,针对SoC不同模块(如CPU核心、缓存、I/O)独立调控性能与功耗,结合先进电源管理电路,显著降低空闲功耗并提升能效比。
Abstract
This fourth generation UltraSPARC T3 SoC pro- cessor implements sixteen 8-threaded SPARC cores to double on-chip thread count and throughput performance over its pre- vious generation. It enhances glueless scalability to enable up to 512 threads in a 4-way system. A 16-Bank 6 MB L2 Cache, a 512 GB/s hierarchical crossbar and a 312-lane SerDes I/O of 2.4 Tb/s support the bandwidth required by the large number of threads. This SoC processor integrates the memory controller, PCIE 2.0, 10 Gb Ethernet ports, and required cache coherency support in multi-chip configurations. Multiple clock and power domains are used to optimize performance and power for the SoC components. Extensive power management features, from architecture to circuit techniques, optimize both active and idle power. The 377 mm /50die includes 1 billion transistors in a flip-chip ceramic package with 2117 pins. The chip is fabricated in TSMC’s 40 nm high-performance process with 11 Cu metals and four transistor types.