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JSSC 2011第1期Other

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology Geert V an d

探讨低成本3D TSV技术的关键设计问题与考虑因素
未明确提及
3D TSV热管理可靠性噪声耦合ESD
3D TSV对BEOL互连可靠性影响有限
TSV应力导致MOS器件阈值电压偏移
3D芯片堆叠热斑温度比2D芯片高三倍
Abstract
Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs , Member , IEEE, Dimitri Linten , Member , IEEE, Michele Stucchi, Guruprasad Katti, Dimitrios V elenis, Vladimir Cherman, Bart V andevelde, V eerle Simons, Ingrid De Wolf, Senior Member , IEEE, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan V an Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul