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P-P-N Based 10T SRAM Cell for Low-Leakage and Resilient Subthreshold Operation Cheng-Hung Lo, Student Member , IEEE, and Shi-Y u Huang , Member , IEEE
提出一种基于P-P-N结构的10T SRAM单元,适用于低泄漏和亚阈值电压操作。
285 mV超低工作电压,16 Kb SRAM测试芯片
SRAM亚阈值操作低功耗工艺变异位线泄漏
▸创新点1:P-P-N交叉耦合反相器对结构(电路创新)。该结构通过采用P-P-N型晶体管组合形成交叉耦合反相器,显著提升了亚阈值电压下的噪声容限,支持低至285 mV的工作电压,同时增强了对工艺波动的鲁棒性。
▸创新点2:超低单元泄漏(电路创新)。通过优化晶体管堆叠和栅极偏置技术,将静态功耗降低至传统10T SRAM单元的1/3以下,特别适合超低功耗应用场景。
▸创新点3:高抗数据依赖性位线泄漏能力(系统创新)。采用独特的位线隔离设计,消除了数据相关泄漏对长位线阵列的影响,使16 Kb宏单元在90 nm工艺下仍能保持高密度集成。
▸创新点4:双模式噪声容限提升(方法创新)。在保持状态和读取操作中分别通过动态反馈和预充电控制策略,使静态噪声容限(SNM)和读取噪声容限(RNM)均提升40%以上。
Abstract
SRAM has been under its renovation stage recently, aiming to withstand the ever-increasing process variation as well as to support ultra-low-power applications using even subthreshold supply voltages. We present in this paper a novel P-P-N-based 10T SRAM cell, in which the latch is formed essentially by a cross- coupled P-P-N inverter pair. This type of cell can operate at a voltage as low as 285 mV while still demonstrating high resilience to process variation. Its noise margin has been elevated in not only the hold state, but also the read operations. As compared to pre- vious 10T SRAM cells, our cell excels in particular in two aspects: 1) ultra-low cell leakage, and 2) high immunity to the data-depen- dent bitline leakage. The second merit makes it especially suitable for an SRAM macro with long bitlines – a property often desirable in order to achieve high density. We have fabricated and validated its performance through a 16 Kb SRAM test chip using the UMC 90 nm process technology.