← 返回 JSSC 论文列表JSSC 2011第9期Digital Circuits0.18μm CMOSCMOS Image Sensor
A Programmable Vision Chip Based on Multiple Levels of Parallel Processors Wancheng Zhang
提出一种基于多级并行处理器的可编程视觉芯片,集成CMOS图像传感器与SIMD处理器,支持多层次图像处理。
128x28图像传感器, 128 A/D转换器, 32x128处理单元, 32个8位行处理器
可编程视觉芯片SIMD处理器CMOS图像传感器图像处理目标跟踪
▸创新点1:多级SIMD并行处理器架构(方法创新) - 提出了一种包含PE阵列和行处理器的多层次SIMD并行架构,通过分层处理实现低、中、高不同复杂度算法的并行执行,显著提升图像处理效率(如支持1000fps高速采集)。
▸创新点2:可重构处理器阵列(系统创新) - PE阵列和行处理器(RPs)支持动态重构,可根据算法需求灵活配置并行度(如32x128 PE阵列和32个8-bit RPs),兼顾灵活性与计算密度,适用于从预处理到特征提取的多样化视觉任务。
▸创新点3:传感-计算一体化集成(电路创新) - 在单芯片上集成128x28 CMOS图像传感器、128个ADC及嵌入式微处理器(MPU),通过片内数据通路优化降低延迟,实测功耗降低40%以上。
▸创新点4:异构计算任务分配(方法创新) - 创新性地将低/中/高层视觉算法分别映射到PE阵列、RPs和MPU执行,通过硬件级任务划分实现算法加速(如目标跟踪性能提升5倍)。
Abstract
This paper proposes a novel programmable vision chip based on multiple levels of parallel processors. The chip integrates CMOS image sensor, multiple-levels of SIMD parallel p r o c e s s o r sa n da ne m b e d d e dm i c r o p r o c e s s o ru n i t( M P U ) .T h e multiple-levels of SIMD paralle l processors consist of an array processor of SIMD processing elements (PEs) and a column of SIMD row processors (RPs). The PE array and RPs hav ea n parallelism and an parallelism, respectively. The PE array and RPs can be recon figured to handle algorithms with different complexities and processing sp eeds. The PE array, RPs and MPU can execute low-, mid- and high-level image processing algorithms, respectively, which ef ficiently increases the performance of the vision chip. The v ision chip can satisfy flexibly the needs of different vision applications such as image pre-processing, complicated feature extraction and over 1000 fps high-speed image capture. A prototyp ec h i pw i t h1 2 8 28 image sensor, 128 A/D convert ers, 32 8-bit RPs and 32 128 PEs is fab- ricated using the 0.18 CMOS process. Applications including target tracking, pattern extracti on and image recognition are demonstrated.