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JSSC 2011第10期RF & Wireless35nm/20nm

Metamorphic HEMT MMICs and Modules Operating Between 300 and 500 GHz Axel Tessma

开发300-500GHz频段的亚毫米波单片集成电路和模块,用于新一代传感器和高速无线通信系统。
460GHz放大器、440GHz倍频器、500GHz放大器
亚毫米波单片集成电路mHEMT技术放大器倍频器
35-nm InAlAs/InGaAs基mHEMT技术
接地共面波导电路拓扑结构
集成波导过渡的全频带S-MMIC放大器模块
Abstract
In this paper, we present the development of sub- millimeter-wave monolithic integrated circuits (S-MMICs) and modules for use in next-generation sensors and high-data-rate wireless communication systems, operating in the 300–500-GHz frequency regime. A four-stage 460-GHz ampli fier MMIC and a 440-GHz class-B frequency doubler c ircuit have been successfully realized using our 35-nm InAlAs/InGaAs-based metamorphic high-electron mobility transis tor (mHEMT) technology in com- bination with grounde