← 返回 JSSC 论文列表JSSC 2011第12期RF & Wireless40nm
A 125125 Gbs Full-Duplex Plastic Waveguide Interconnect Satoshi Fukuda Yasufumi
展示了一种基于塑料波导的新型互连解决方案，实现全双工12.5 Gb/s数据传输。
40nm CMOS, 57/80 GHz载频, 0.41mm²面积, 140mW功耗, 12.5Gb/s全双工
塑料波导毫米波全双工CMOS互连
▸使用低成本塑料波导作为毫米波信号传输介质
▸无需光电转换设备或精确对准
▸支持多波导并行和多频复用以提高数据速率
Abstract
ki Yamagishi,
Satoru Shinke, Kenji Komori , Member , IEEE, Masahiro Uno , Member , IEEE, Yoshiyuki Akiyama,
Kenichi Kawasaki, Member , IEEE, and Ali Hajimiri , Fellow, IEEE
Abstract—A new interconnect solution with plastic waveguide
is demonstrated. The system consists of a pair of transceivers and
a plastic waveguide. Millimeter wave signal is transmitted in a
low-cost long piece of solid plastic dielectric acting as a waveguide.
The plastic waveguide medium offers a large bandwidth for
data co