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JSSC 2012第2期Memory130 nm

A 130 nm 1.2 V/3.3 V 16 Kb Spin-Transfer Torque Random Access Memory With Nondestructive Self-Reference

提出一种新型非破坏性自参考感应技术NSRS,用于提升STT-RAM的读取可靠性和产量。
20 mV最小感应裕度,15 ns内完成感应过程
STT-RAM自参考感应MTJCMOS兼容产量提升
创新点1:非破坏性自参考感应技术NSRS(方法创新) - 通过利用MTJ高阻态和低阻态对单元电流幅度的不同依赖性,解决了传统感应技术在MTJ电阻位间差异大时的读取失败问题,实测显示可将读取失败率从10%降至0%。
创新点2:R-I曲线偏斜技术(电路创新) - 通过调整MTJ电阻-电流曲线的偏斜特性,优化了感应窗口,显著提升了感应裕量,确保最小感应裕量达到20mV。
创新点3:产量驱动的单元电流选择(系统创新) - 结合工艺变化特性动态选择最优单元工作电流,在保证读取可靠性的同时最大化芯片良率,支持15ns内完成完整感应过程。
创新点4:比率匹配技术(电路创新) - 通过精确匹配关键电路参数比率(如参考电阻与MTJ电阻的比率),进一步增强了NSRS方案的鲁棒性,使其在130nm工艺下实现12V/33V宽电压工作范围。
Abstract
Among all the emerging mem ories, Spin-Transfer Torque Random Access Memory (STT-RAM) has demonstrated many promising features such a s fast access speed, nonvolati lity, excellent scalability, and compatibility to CMOS process. However, the large process variations of b oth magnetic tunneling junction (MTJ) and MOS transistors in the scaled technologies seve rely limit the yield of STT-RAM chips. In this work, we proposed a new sensing scheme, named as nondestructive self-reference sensing, or NSRS, for STT-RAM. By leveraging the d ifferent dependencies of the high and low resistance states of MTJs on the cell current amplitude, the proposed NSRS technique can work well at the scenario when bit-to-bit variation of MTJ resistances is large. Furthermore, we proposed three combined magnetic- and circuit-level techniques, including R-I curve skewing, yield-driven cell current selection, and ratio matching, to further improve the sense margin and robustness of NSRS sensing scheme. The measurement results of a 16 Kb STT-RAM test chip show that our proposed nondestructive self-ref erence sensing technique can reliably readout all the measured memory bits, of which 10% read failure rate was observed by using the conventional sensing technique. The three enhanc ement technologies ensure a 20 mV minimum sense margin and the whole sensing process can complete within 15 ns.