← 返回 JSSC 论文列表JSSC 2012第7期Memory65nmSRAM
A 65 nm, 850 MHz, 256 kbit, 4.3 pJ/access, Ultra Low Leakage Power Memory Using Dynamic Cell Stability and a Dual Swing Data Link Bram Rooseleer,S t u d e n tM e m b e r ,I E E E
本文设计了一种高速超低功耗SRAM存储器,采用分位线和局部写感放大器等技术,显著降低功耗并提升性能。
65nm CMOS, 850MHz, 4.3pJ/access, 25.2μW standby leakage
SRAM低功耗高速分位线局部写感放大器
▸分位线设计提高动态单元稳定性并降低能耗
▸局部写感放大器实现全局位线低摆幅信号
▸使用高阈值晶体管减少静态功耗并提升读取稳定性
Abstract
This paper presents the design of a high-speed ultra low power SRAM memory. Divided bit lines improve dynamic cell stability while at the same time dec reasing active energy consump- tion. To limit unnecessary activ ity, word lines are divided on a word-by-word basis. Local write sense ampli fiers make it possible to use low swing signaling on the global bit lines. To control this architecture, a distributed decoder is used. The use of dual swing data links on the global bit lines limits the impact of local write sense ampli fier offset on the overall energy consumption. Using high threshold transistors in the memory cells reduces static power consumption and improves the cell’s read stability. A partly dy- namic decoder structure increases memory speed at a very low en- ergy cost. The timing of this memory is made con figurable to be able to cope with PVT variations without increasing design mar- gins. The designed 256 kbit memory was fabricated in a 65 nm triple- process. It operates up to a speed of 850 MHz while only consuming 4.3 pJ/access for a word length of 32 bit. Standby leakage power is 25.2 W. This memory clearly outperforms other state-of-the-art designs when ta rgeting high-speed, low-leakage and low active energy applications.