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JSSC 2012第11期RF & Wireless0.11μmVCO

An Ultra-Low-Cost High-Performance Bluetooth SoC in 011- mC M O S Sam Chun-Geik

采用0.11μm CMOS工艺实现的高集成度低成本高性能蓝牙3.0+EDR SoC
10 dBm TX输出功率, 95.5 dBm接收灵敏度, 48 mA TX电流, 35 mA RX电流
蓝牙SoC低成本高性能CMOS集成巴伦
集成TX/RX共享巴伦,无需T/R开关
4 LO-based VCO减少LO牵引和TX带外杂散
高输出功率和低接收灵敏度
Abstract
A highly integrated ultra-low-cost high-performance Bluetooth 3.0+EDR SoC is implemented in 0.11- md i g i t a lC M O S technology. The transceiver has a n integrated balun shared be- tween TX and RX, eliminating the need for a separate T/R switch. A4 LO-based VCO is implemented to reduce LO pulling and to minimize TX out-of-band spurious emissions. The transmitter pro- vides high output power of 10 and 7 dBm in BDR and EDR3 modes respectively, with 1.5-kHz frequency stability and 6% rms DEVM. T