A Modular 1 mm Die-Stacked Sensing Platform With Low Power I C Inter-Die Communication and Multi-Modal Energy Harvesting Y

Abstract

A1 . 0m m general-purpose sensor node platform with heterogeneous multi-layer s tructure is proposed. The sensor platform bene fits from modularity by allowing the addition/re- moval of IC layers. A new low power C interface is introduced for energy ef ficient inter-layer communication with compatibility to commercial C protocols. A self-adapting power management unit is proposed for ef ficient battery voltage down conversion for wide range of battery voltages and load current. The power man- agement unit also adapts itself by monitoring energy harvesting conditions and harvesting sources and is capable of harvesting from solar, thermal and microbial fuel cells. An optical wakeup receiver is proposed for sensor node programming and synchro- nization with 228 pW standby power. The system also includes two processors, timer, temperature sensor , and low-power imager. Standby power of the system is 11 nW.