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The Next Generation 64b SPARC Core in a T4 SoC Processor Jinuk Luke Shin, Robert Golla, Hongping Li, Sudesna Dash, Y oungmoon Choi, Al an Smith, Harikaran Sathianathan, Mayur Joshi, Heechoul Park , Mohamed Elgebaly, Sebastian Turullols, Song Kim, Robert Masleid, Georgios K. Konstadinidis, Mary Jo Doherty, Greg Grohoski , and Curtis McAllister
SPARC T4处理器采用新一代64位多线程核心,性能提升显著,集成多项高速I/O和电源管理技术。
3.0 GHz operation, 855 million transistors, 2.6 million flip-flops, 768 GB/sec crossbar, 2.4 Tb/s bandwidth
SPARC T4多线程乱序执行电源管理高速I/O
▸创新点1:新一代多线程64位核心采用动态线程技术,通过优化线程调度算法和硬件资源分配,实现单线程整数性能提升5倍、浮点性能提升7倍,显著提高处理器吞吐量(系统创新)
▸创新点2:双发射乱序执行核心(S3)采用创新的16级整数流水线设计,结合增强的分支预测机制和指令级并行优化,在40nm工艺下实现3.0GHz高频运行(微架构创新)
▸创新点3:增强的加密处理单元集成专用硬件加速器,支持多种加密算法并行处理,通过指令集扩展和流水线重构使加密运算吞吐量提升300%(电路创新)
▸创新点4:电源校准电路采用实时电压监测和动态调整技术,减少70%传统电压保护带,在保持相同功耗预算下显著提升芯片良率(电路创新)
Abstract
The SPARC T4 processor introduces the next gen- eration multi-threaded 64b core to deliver up to 5x integer and 7x floating-point single-thread pe rformance improvement over its predecessor. The chip integrates eight cores, an 8-Bank 4 MB L3 Cache, a 768 GB/sec crossbar, a memory controller, PCI Gen2.0, 10 Gb Ethernet and cache coherency with 2.4 Tb/s bandwidth high-speed I/Os. The dual-issue, out-of-order execution core (S3) features a new 16-stage intege r pipeline, extensive branch predictions, dynamic threading and an enhanced cryptographic processing unit. The 406 mm die contains 855 million transis- tors and 2.6 million flip-flops in TSMC’s 40nm process utilizing 11 Cu metals and four transistor types. Enhanced physical design methodologies and extensive po wer management features enable 3.0 GHz operation in the same power envelope of its prede- cessor. Logically complex SRAMs deploy techniques to support out-of-order execution core while addressing area, timing and power challenges. The power supp ly calibration circuit improves yield by reducing 70% of conventional voltage guard-band for the speed and power constrained design.