High-Throughput Signal Component Separator for Asymmetric Multi-Level Outphasing

Abstract

This paper presents an energy-ef ficient high - throughput and high-precision s ignal component separator (SCS) chip design for the asymmetric-m ultilevel-outphasing (AMO) power ampli fier. It uses a fixed-point piece-wis el i n e a rf u n c t i o n a l approximation developed to improve the hardware ef ficiency of the outphasing signal processing functions. The chip is fabricated in 45 nm SOI CMOS process and the SCS consumes an active area of 1.5 mm . The new algorithm enables the SCS to run at a