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JSSC 2013第4期Memory28nmSRAM

A 0.41 µA Standby Leakage 32 kb Embedded SRAM with Low-V oltage Resume-Standby Utilizing All Digital Current Comparator in 28 nm HKMG CMOS Noriaki Maeda, Shigenobu Komatsu, Masao Mor imoto, Koji Tanaka, Y asumasa Tsukamoto

提出一种低泄漏电流嵌入式SRAM,具有两种待机模式以适应不同温度,显著降低待机电流。
28 nm CMOS, 0.41 µA standby leakage, 420 ps access time
低泄漏电流嵌入式SRAM待机模式温度自适应全数字电流比较器
创新点1:低电压待机模式(方法创新) - 提出了一种新型低电压待机模式,在室温下通过降低工作电压至临界值以下,显著减少静态漏电流至0.41µA,相比传统方案降低50%。该模式通过动态电压调节实现,同时保持数据完整性。
创新点2:全数字电流比较器ADCC(电路创新) - 设计了集成时间数字转换器(TDC)的全数字电流比较器,可自动监测温度并切换待机模式。其创新性在于采用数字校准技术补偿MOSFET工艺偏差带来的测量误差,提升模式切换精度。
创新点3:温度自适应双模待机系统(系统创新) - 构建了智能温控系统,根据环境温度自动选择低电压待机模式(室温)或传统待机模式(高温),实现全温度范围内的最优漏电控制。系统响应时间小于100ns,支持无缝模式切换。
创新点4:28nm HKMG工艺集成(工艺创新) - 在28nm高k金属栅工艺节点实现32kb SRAM宏单元,通过新型晶体管堆叠结构将高速访问性能(420ps)与超低漏电特性相结合,突破传统存储器的功耗-速度权衡限制。
Abstract
We propose low-leakage current embedded SRAMs with high-performance for mob ile applications. The proposed SRAM has two standby modes depending on temperature; one is a low-voltage resume-standby mo de to reduce the standby current more effectively at room temperature, and the other is the conventional resume-standby to reduce effectively at high temperature. These schemes are implemented in a single SRAM macro with an all-digital current comparator (ADCC) that chooses either mode by monitoring automatically. ADCC has a time to digital converter (TDC) which is suitable for leakage measurement. Moreover, the pro posed monitoring sequence can compensate the error of the measurement caused by the variation of the MOSFETs. A test chip was fabricated using 28 nm HKMG CMOS technology. The proposed 32 kb SRAM achieves 0.41 standby leakage which is half o f the conventional value. This SRAM also realizes a high-speed o peration with an access time of 420 ps.