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An Energy Efficient 32-nm 20-MB Shared On-Die L3 Cache for Intel Xeon Processor E
英特尔Xeon处理器E5系列中一款能效优化的32纳米20MB共享片上L3缓存设计
32nm工艺, 0.7V-1.0V电压范围, 1.2GHz-4.0GHz频率范围
L3缓存能效优化Xeon处理器高K金属栅工艺冗余设计
▸采用0.2119um高密度大阵列单元和0.2725um高性能小阵列单元
▸先进的节能方案和Vccmin设计技术提升能效
▸支持高密度模块化和能效优化的缓存拓扑结构
Abstract
An energy ef ficient on-die 20-way set associative L3
c a c h eo fs i z e2 0M Bf o rt h eI n t e l ®X e o n ®p r o c e s s o rE 5f a m i l yi s
presented. It is manufactured in the Intel’s 32-nm second gener-
ation of high-K dielectric metal gate process with 9-copper metal
layers. The L3 cache design uses 0.2119 um
cell for the high den-
sity big array and 0.2725 um cell for the high performance smaller
arrays. The power ef ficiency was achieved by employing advanced
power saving schemes and effe