← 返回 JSSC 论文列表
📄 下载 JSSC 原文 PDF
JSSC 2013第9期RF & Wireless0.35μm

A Wireless Stress Mapping System for Orthodontic Brackets Using CMOS Integrated

一种用于正畸托槽的无线应力映射系统,通过CMOS集成技术实现牙齿受力监测。
0.35μm CMOS, 10-bit SAR ADC, 11kPa分辨率, 1.75mW功耗
无线应力映射正畸托槽CMOS集成应力传感器负载调制
创新点1:晶体管应力传感器阵列(方法创新) - 采用24个晶体管传感器在芯片上战略分布,可同时测量平面剪切应力和平面法向应力差,实现高密度应力映射,分辨率达11 kPa,为牙齿受力提供精确监测。
创新点2:可变增益差分放大器处理信号(电路创新) - 设计可变增益差分差动放大器处理传感器信号,结合10位SAR ADC实现高精度数字化,动态适应不同应力范围,提升系统灵敏度与信噪比。
创新点3:13.56MHz无线能量传输与数据通信(系统创新) - 集成射频能量收集与负载调制数据传输,通过微型电镀金线圈实现无电池供电(功耗1.75mW)和实时数据回传,满足植入式设备的尺寸约束(2×2.5×0.73mm)。
创新点4:微型化系统集成(系统创新) - 在0.35μm CMOS工艺下实现传感器、信号链与无线模块的全集成,首次将应力监测系统尺寸压缩至正畸托槽可装配级别,为智能托槽商业化奠定基础。
Abstract
A wireless stress mapping system for the development of “smart brackets” is presented . The system is designed for mon- itoring the forces and moments ap plied to individual teeth during orthodontic therapy which may contribute to i mprove treatment effectiveness. It comprises a stress mapping chip fabricated in a 0.35- m process and a micro coil produced by gold electroplating in a photoresist mask. Twenty-four transis tor-based stress sensors for measuring either in-plane shear stress or the d