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A Process-V ariation-Tolerant On-Chip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM Daeyong Shim, Hyunsik Jeong
提出一种用于DRAM温度自适应刷新的片上CMOS温度计,显著降低自刷新电流。
3.2 mV/°C灵敏度,0.36 μW功耗,1.1V供电
CMOS温度计DRAM自适应刷新低功耗片上集成
▸创新点1:采用新型温度传感器设计,通过优化CMOS工艺下的温度敏感元件结构,实现了3.2 mV/°C的高灵敏度(0-110°C范围),属于电路创新。
▸创新点2:实现1.94°C分辨率,该性能由电阻阶梯的6.2 mV步进限制而非传感器自身设计限制,表明电路架构具备潜在更高分辨率能力,属于系统级优化创新。
▸创新点3:支持单点校准技术,利用传感器优异的线性特性(误差±1.42°C至2.66°C),显著降低量产测试成本,属于方法创新。
▸创新点4:集成于44nm LPDDR2芯片并实现0.36μW超低功耗(1.1V供电),面积仅0.001725 mm²,在0°C时使IDD6电流降低50%,属于系统级能效创新。
Abstract
Smaller transistors mean that capacitors are charged less uniformly, which increases the self-refresh current in the DRAMs used in mobile devices. Adaptive self-refresh using an on-chip thermometer can solve this problem. We propose an on-chip CMOS thermometer speci fically designed for controlling the refresh period of a DRAM. This thermometer includes a novel temperature sensor which has been implemented and integrated into an LPDDR2 chip. The LPDDR2 chip is fabricated in a 44-nm DRAM process. The sensor has a temperature sensitivity of 3.2 mV C, over a range of 0 Ct o1 1 0 C. Its resolution is 1.94 C and is only limited by the 6.2-mV step of the associated resistor ladder not by its own design. The linearity of the sensor permits one-point calibration, after which the error si n6 1s a m p l e circuits ranged between 1.42 Ca n d 2.66 C .T h es e n s o rh a s an active area of 0.001725 mm and consumes less than 0.36 W on average with a supply of 1.1 V. At its lowest op erating temper- ature, this thermometer reduc es the IDD6 current of the LPDDR2 chip by almost half.