← 返回 JSSC 论文列表JSSC 2013第12期Wireline I/O28nmHigh-Speed Link
A 0.54 pJ/b 20 Gb/s Ground-Referenced Single-Ended Short-Reach Serial Link in 28 nm CMOS for Advanced
28nm工艺下实现20Gb/s低功耗短距离单端串行链路,采用地参考信号技术。
28nm CMOS, 0.9V, 20Gb/s, 0.54pJ/bit, 4.5mm有机基板通道
单端信号传输地参考信号电荷泵驱动器短距离互连低功耗设计
▸创新点1:地参考信号技术(GRS) - 该方法创新性地采用地平面作为参考,通过上下信号传输消除传统单端设计的共模噪声问题,在28nm工艺中实现20Gb/s的高速信号传输,显著提升信号完整性。
▸创新点2:新型电荷泵驱动器 - 该电路创新设计通过电荷泵结构实现数据独立的电流消耗,彻底解决了同步开关噪声(SSN)问题,在0.9V电源电压下仅消耗0.54pJ/bit的超低功耗。
▸创新点3:系统级协同设计 - 将信号系统与互连结构协同优化,利用有机基板/硅中介层特性,在4.5mm通道长度上实现BER<10^-12的可靠传输,时序裕量达0.3UI。
▸创新点4:高密度集成方案 - 通过16通道链路集成和时钟转发技术,在单芯片上实现320Gb/s总带宽,为高密度数字系统提供可扩展的片间互连解决方案。
Abstract
High-speed signaling over h igh density interconnect on organic package substrates or silicon interposers offers an attractive solution to the off-chip bandwidth limitation problem f a c e di nm o d e r nd i g i t a ls y s t e m s .I nt h i sp a p e r ,w ed e s c r i b eas i g - naling system co-designed with the interconnect to take advantage of the characteristics of this environment to enable a high-speed, low area, and low-power die to die link. Ground-Referenced Sig- naling (GRS) is a single-ended signaling system that eliminates the major problems traditionally asso ciated with single-ended design by using the ground plane as the reference and signaling above and below ground. This design employs a novel charge pump driver that additionally eliminates the issue of simultaneous switching noise with data independent current consumption. Silicon mea- surements from a test chip implementing two 16-lane links, with forwarded clocks, in a standard 28 nm process demonstrate 20 Gb/s operation at 0.54 pJ/bit over 4.5 mm organic substrate channels at a nominal 0.9 V power supply voltage. Timing margins at the receiver are 0.3 UI at a BER of 10 .W ee s t i m a t e BER 10 at the eye center.