← 返回 JSSC 论文列表JSSC 2014第1期Digital Circuits90nm
A 0.15-mm-Thick Noncontact Connector for MIPI Using a V ertical Directional Coupler Atsutake Kosuge, Student Member , IEEE, Wataru Mizuhara , Student Member , IEEE, Tsunaaki Shidei, Tsutomu Takeya, Student Member , IEEE
开发了一种用于MIPI应用的0.15毫米厚非接触连接器，采用垂直定向耦合器实现双链路通信。
2.3 Gb/s/link, 1.47 pJ/b, 320 ps (64% U.I.)单链路, 305 ps (61% U.I.)双链路
非接触连接器MIPI垂直定向耦合器电磁干扰抑制高速数据传输
▸创新点1：方法创新 - 开发了全球首个0.15毫米厚的非接触连接器，采用垂直定向耦合器（VDC）技术，显著减小了连接器的厚度，适用于超薄移动设备。
▸创新点2：电路创新 - 使用全平衡脉冲发射器，基于90纳米CMOS技术，有效抑制了电磁干扰（EMI），符合MIPI标准要求，提升了信号传输的稳定性。
▸创新点3：系统创新 - 实现了双链路通信，通过单个耦合器同时传输两路信号，且未导致显著的性能下降，最大数据速率达到2.3 Gb/s/link，功耗仅为1.47 pJ/b。
▸创新点4：性能创新 - 在2.0 Gb/s速率下，单链路的时序裕量为320 ps（64% U.I.），双链路的时序裕量为305 ps（61% U.I.），确保了高速数据传输的可靠性。
Abstract
A noncontact and housing-less thin–thick connecting method was developed for mobile indus try processor inter- face (MIPI) applications. This paper describes the world’s first 0.15-mm-thick connect or using a vertical directional coupler (VDC) which enables simultane ous two-link communication with one coupler without fatal performance degradation. We have analyzed the conditions for isolating two links in a coupler, and t h ed e s i g nm e t h o di sd i s c u s sed. A fully balanced pulse transmitter implemented in 90-nm CMOS technology signi ficantly suppressed electromagnetic interference (EMI), which agrees well with MIPI requirements. An exper imental liquid crystal display interface system reached a maximum data rate of 2.3 Gb/s/link at a bit error rate of less than and a power consumption of 1.47 pJ/b. The timing margin of s ingle link was 320 ps ( 64% U.I.) and of two links was 305 ps ( 61% U.I.) at 2.0 Gb/s.