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Introduction to the Special Issue on the 2013 Symposium on VLSI Circuits T HIS i
2013年VLSI电路研讨会精选论文介绍，涵盖电路设计与半导体技术的最新进展。
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VLSI电路半导体技术IEEE JSSC研讨会电路设计
▸创新点1：VLSI电路设计的最新进展，包括数字、存储、模拟、无线和有线通信电路的前沿技术，展示了高性能、低功耗设计方法，如新型时钟分配网络和电源管理技术。
▸创新点2：半导体技术的创新应用，涵盖先进工艺节点下的器件优化和新型材料集成，如FinFET和3D堆叠技术的性能提升与能效优化。
▸创新点3：国际学术与工业界的合作交流，通过联合焦点会议促进跨领域协作，推动从器件工艺到系统设计的全链条创新，加速技术产业化。
▸创新点4：系统级创新，通过多学科交叉（如电路与工艺联合设计）实现整体性能突破，例如在无线通信系统中集成毫米波与基带处理模块。
Abstract
highlights some of the best papers from the
2013 Symposium on VLSI Circuits, which was held at the
Rihga Royal Hotel Kyoto, Kyoto, Japan, on June 12–14,
2013. In 2013, the Symposium held its 27th meeting on
state-of-the-art topics important to VLSI circuit and system
designers, as well as device and process technology experts.
Industry and academia from all o ver the world presented papers
at the Symposium highlighting important technical contribu-
tions and recent advances in VLSI circuit desig