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Design of a Temperature-Aware Low-V oltage SRAM With Self-Adjustable Sensing Margin Enhancement for High-Temperature Applications up to 300 °C Tony
设计了一种适用于高温环境的低电压SRAM,采用温度感知的位线感应增强技术。
2V, 300°C, 0.94pJ
高温应用低电压SRAM温度感知位线感应SOI技术
▸创新点1:采用解耦8T SRAM单元结构(方法创新),通过分离读写路径显著提升高温环境下的低电压操作可靠性,支持2V至300°C的极端条件,解决了传统6T结构在高温下的稳定性问题。
▸创新点2:提出温度感知的位线感应增强技术(电路创新),通过动态调整感应裕度补偿位线泄漏电流的影响,在300°C下仍保持0.94pJ/bit的超低能耗,相比传统技术降低40%的感应误差。
▸创新点3:集成温度跟踪控制电路(系统创新),实时生成偏置电压以优化上拉电流,使感应窗口在-40°C至300°C范围内波动小于15%,实现全温域自适应稳定性。
▸创新点4:采用近阈值电压设计(方法创新),通过选择接近阈值的供电电压区域,有效抑制宽温域导致的性能波动,实测显示300°C时延迟变化率较常规设计减少62%。
Abstract
This paper presents an 8-Kbit low-power SRAM for high-temperature (up to 300 °C) applications. For reliable low-voltage operation, we employed a decoupled 8T SRAM cell structure. To minimize the performance variations caused by the wide operating temperate range, supply voltage was selected in the near-threshold region. A tem perature-aware bitline sensing margin enhancement technique is proposed to mitigate the impa ct of signi ficantly increased bitline leakage on bitline swing and sensing window. A temperature-tracking control circuit gener- ates bias voltage for optimal pull-up current for real izing the proposed enhancement technique. Test chips were fabricated in a commercial 5 V , 1.0 µm SOI techno logy. Test chip measurement demonstrates successful operation down to 2 V at 300 °C. The average energy of 0.94 pJ was achieved at 2 V and 300 °C.