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A 1.22 TOPS and 1.52 mW/MHz Augmented Reality Multicore Processor With Neural Network NoC for HMD Applications Gyeonghoon Kim, Student Member , IEEE , Kyuho Lee , Student Member , IEEE , Y ouchang Kim, Student Member , IEEE
一款用于增强现实头戴显示系统的低功耗高性能多核处理器
65nm CMOS, 1.2V, 250MHz, 381mW平均功耗, 1.22TOPS峰值性能
增强现实多核处理器低功耗设计神经网络加速动态电压频率调整
▸任务级流水线SIMD-PE集群
▸拥塞感知片上网络(NoC)
▸基于混合模式SVM的动态电压频率调整(DVFS)
Abstract
Real-time augmented reality (AR) is actively studied for the future user interface and experience in high-performance head-mounted display (HMD) systems. The small battery size and limited computing power of the current HMD, however, fail to implement the real-time m arkerless AR in the HMD. In this paper, we propose a real-time and low-power AR processor for advanced 3D-AR HMD applications. For the high throughput, the processor adopts task-level pipelined SIMD-PE clusters and a con- gestion-aware network-on-chip (NoC). Both of these two features exploit the high data-level parallelism (DLP) and task-level paral- lelism (TLP) with the pipelined multicore architecture. For the low power consumption, it employs a vocabulary forest accelerator and a mixed-mode support vec tor machine (SVM)-based DVFS control to red uce unnecessary external memory accesses and core activation. The proposed 4 mm 8m mH M DA Rp r o c e s s o ri s fabricated using 65 nm CMOS technology for a battery-powered HMD platform with real-time AR operation. It consumes 381 mW average power and 778 mW peak power at 250 MHz operating frequency and 1.2 V supply volt age. It achieves 1.22 TOPS peak performance and 1.57 TOPS/W energy ef ficiency, which are, respectively, and higher than the state of the art.