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JSSC 2015第4期Other0.18µm

A Monolithically-Integrated Chip-to-Chip Optical Link in Bulk CMOS Chen Sun S t

在0.18µm体CMOS工艺中实现单片集成硅光互连芯片,支持5Gb/s数据传输。
350fJ/bit发射能耗,71µApp接收灵敏度(BER=10^-12),5Gb/s速率,45Gb/s波分复用
硅光子学CMOS集成波分复用谐振探测器热调谐
采用深沟隔离和注入非晶化技术降低多晶硅波导损耗
提出基于多晶硅的谐振缺陷陷阱光电探测器,无需锗集成
片上热调谐反馈环路锁定谐振波长
Abstract
Silicon-photonics is an emerging techno logy that can overcome the tradeoffs faced by traditional electrical I/O. Due to ballooning development costs for advanced CMOS nodes, however, widespread adoption necessitates seam less photonics in- tegration into mainstream proce sses, with as few process changes as possible. In this work, we demonstrate a silicon-photonic link with optical devices and electronics integrat ed on the same chip i na0 . 1 8µ mb u l kC M O Sm e m o r yp e r i p h e r yp r o