Capacitive Proximity Communication With Distributed Alignment Sensing for Origam

Abstract

Origami implant design is a 3D integration technique which addresses size and cost constraints in biomedi cal implants. This paper presents a capacitive proximity interconnect scheme that enables chip-to-chip co mmunication across folds in the Origami implant, allowing increased flexibility o fc h i pp l a c e m e n t and orientation. The capacitive plate array senses link quality and chip-to-chip alignment, and adapts the data rate at each plate accordingly, shutting down poorly-coupled li nks t