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Introduction to the Special Section on the 2014 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
2014年IEEE射频集成电路研讨会精选论文，涵盖无线收发器、射频前端、毫米波设计等。
7 dB功率增益，24–54 GHz，34 mW，IIP3 11 dBm，噪声系数6.2 dB
无线收发器射频前端毫米波设计频率合成器高速数据收发器
▸创新点1：高分数带宽带通分布式放大器，通过减少电感元件值实现面积高效布局，提供7 dB功率增益，频率范围24-54 GHz，功耗34 mW，IIP3为11 dBm，噪声系数6.2 dB。
▸创新点2：数字极化Doherty功率放大器，采用65 nm CMOS工艺，提升背偏操作效率，灵活权衡效率与线性度，增强天线失配鲁棒性，1Msymbol/s QPSK信号下，RMS EVM为3.5%，平均输出功率23.5 dBm，漏极效率26.8%。
▸创新点3：高效背偏操作设计，应用于25 dBm类D输出相位放大器，采用45 nm CMOS工艺，通过交叉桥组合器提升背偏操作效率，适用于900 MHz和2.4 GHz频率，测试结果优异。
Abstract
the IEEE J OURNAL OF
SOLID-STATE CIRCUITS consists of a selection of pa-
pers that were presented at the 2014 IEEE Radio Frequenc y
Integrated Circuits Symposium, held from June 1–3, 2014,
in Tampa, FL, USA. The symposium is co-located with the
IEEE MTT-S International Microwave Sympos ium (IMS),
each year, and is a premier international venue that covers the
latest advances in RF and microwave circuits and systems. The
2014 RFIC symposium featured 102 publ ications contributed
by industry and a