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JSSC 2015第11期Digital Circuits65nmProcessor/CPU

Compact and Supply-V oltage-Scalable Temperature Sensors for Dense On-Chip

提出了一种紧凑且电压可调的温度传感器电路,用于高性能微处理器和SoC的动态热管理。
65nm CMOS, 0.6V, 最坏情况误差7.0°C(64个实例)
温度传感器动态热管理紧凑设计电压可调高密度集成
仅需6至8个NMOS晶体管,面积比现有技术小一个数量级
电源电压可低至0.6V,适合动态电压缩放技术
支持高密度集成,实现密集的热监测
Abstract
This paper presents compact and voltage-scalable temperature sensor circuits for implementing dynamic thermal management (DTM) in high-performance microprocessors and Systems-on-Chips (SoC). The proposed sensor front ends require only 6 to 8 NMOS transistors, resulting in more than one order of magnitude smaller area than the previous state of the art. The sensor supply voltage can be scaled down to 0.6 V , so it can be integrated with digital circuits employing a dynamic-voltage- scaling technique without additional power distribution and regu- lation. Sensor front ends with three different sizes (115, 279, and 400 µm 2) and their back ends have been prototyped in a 65 nm CMOS technology. The measurement results of the 279 µm2 front end at 0.6 V show a worst-case error of 7.0 ◦C across 64 instances 0◦C to 100◦C after a low-cost one-temperature-point calibration. With the same conditions, the measurements of the 400 µm2 front end show a worst-case error of 5.4 ◦C across 64 instances. The compact sensor designs make it possible to integrate an order of magnitude more sensors on a chip with little additional overhead and thereby enable very dense thermal monitoring in digital VLSI systems.