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JSSC 2019第5期RF & Wireless22nm

An E-Band Power Amplifier With 26.3% PAE and 24-GHz Bandwidth in 22-nm FinFET CMOS

本文介绍了一种在22nm FinFET CMOS工艺中实现的E波段功率放大器,具有高效率和宽带宽。
22nm FinFET CMOS, 18.6 dB峰值增益, 62–86 GHz带宽, 26.3%峰值PAE
E波段功率放大器FinFET CMOS毫米波功率附加效率紧凑集成
创新点1:布局优化和单元特性分析(方法创新) - 通过精细的布局优化和单元特性分析,显著提升了毫米波频段下FinFET晶体管的性能,实现了26.3%的峰值功率附加效率(PAE)和+12.6 dBm的饱和输出功率。
创新点2:整体优化方法(系统创新) - 提出了一种整体优化方法,通过在设计早期阶段考虑无源网络的损耗,协同优化有源器件和无源网络的效率,从而实现了24 GHz的带宽和18.6 dB的峰值增益。
创新点3:紧凑布局设计(电路创新) - 采用高度紧凑的布局设计,核心面积仅为0.054 mm²,为毫米波功率放大器的高密度集成提供了可能,同时支持6-Gb/s 16-QAM和9-Gb/s 64-QAM信号的高效放大。
创新点4:高频信号处理能力(性能创新) - 在75 GHz频段下,实现了-26 dB EVM(rms)的16-QAM信号和-28.3 dB EVM(rms)的64-QAM信号的高质量放大,展示了其在E波段通信系统中的优异性能。
Abstract
This paper presents the design and optimization of an E-band power amplifier (PA) implemented in Intel’s 22FFL FinFET process. Layout optimization and characterization of the PA unit cell yielding optimal millimeter-wave (mmW) perfor- mance of the active device are described. A holistic optimization methodology is also presented which co-optimizes efficiency of the active devices and passive networks by incorporating passive losses earlier in the design process. The measured PA achieves a peak gain of 18.6 dB with a 3-dB bandwidth of 62–86 GHz (24 GHz). At 75 GHz, the measured P sat,O P 1d B, and peak power added efficiency (PAE) are +12.6 dBm, +5.7 dBm, and 26.3%, respectively. The PA can amplify a 6-Gb/s 16-QAM signal at an average P out of +5 dBm with a PAE of 10% and −26-dB EVM(rms) and a 9-Gb/s 64-QAM signal at an average Pout of +1.3 dBm with a PAE of 5% and −28.3-dB EVM(rms). The compact layout of the PA yields a core area of 0.054 mm 2, enabling compact integration.