← 返回 JSSC 论文列表JSSC 2019第11期Power Management45/65nm
A Modular Direct Time-of-Flight Depth Sensor in 4565-nm 3-D-Stacked CMOS Technol
介绍了一种模块化直接飞行时间深度传感器，采用3D堆叠CMOS技术，具有高精度和远距离测量能力。
低分辨率模式：300米最大范围，80厘米精度；高分辨率模式：150米最大范围，7厘米精度；28dB干扰抑制
飞行时间深度传感器SPAD3D堆叠CMOSLiDAR
▸模块化设计，每个模块自主操作
▸采用3D堆叠CMOS技术，背照式SPAD探测器
▸脉冲位置调制激光签名，减少干扰
Abstract
This article introduces a modular, direct time-of-
flight (TOF) depth sensor. Each module is digitally synthesized
and features a 2 × (8 × 8) single-photon avalanche diode (SPAD)
pixel array, an edge-sensitive decision tree, a shared time-to-
digital converter (TDC), 21-bit per-pixel memory, and in-locus
data processing. Each module operates autonomously, by internal
data acquisition, management, and storage, being periodically
read out by an external access. The prototype was fabricated
in a TSM