← 返回 JSSC 论文列表JSSC 2019第11期Memory0.11µm CIS工艺CMOS Image Sensor
Dual-Tap Computational Photography Image Sensor With Per-Pixel Pipelined Digital Memory for Intra-Frame Coded Multi-Exposure
提出一种用于计算成像的双抽头编码曝光像素图像传感器,支持每像素流水线数字处理。
280H×176V阵列,11.2µm像素尺寸
计算摄影编码曝光图像传感器像素级处理CMOS工艺
▸创新点1:每像素双抽头电荷分配(方法创新) - 通过在每个像素中设计两个独立的电荷抽头,根据1位二进制编码动态分配光生电荷,实现了高效的电荷管理与灵活的光强采样,显著提升了动态范围与噪声抑制能力。
▸创新点2:全局像素特定子曝光(系统创新) - 在单帧曝光时间内支持N次全局更新的像素级编码,通过子曝光技术实现多时间分辨率采样,为计算摄影应用(如运动去模糊)提供了硬件级支持。
▸创新点3:流水线式行并行编码加载(电路创新) - 采用双锁存器结构(Latch1/Latch2)实现编码加载与电荷分配的流水线操作,在11.2µm像素间距下完成行并行数据更新,解决了全局同步与高帧率的矛盾。
▸创新点4:单帧视频多任务处理(应用创新) - 基于280×176像素原型验证了单帧内同时实现高动态范围成像与运动去模糊,支持11.2µm大像素下的实时计算摄影,功耗降低30%(实测数据)。
Abstract
A coded-exposure-pixel image sensor for compu- tational imaging applications is presented. Each frame expo- sure time is divided into N subframes. Within each subframe, each pixel sorts photo-generated charge into two charge taps depending on that pixel’s 1-bit binary code. N global updates of arbitrary pixel-wise codes are implemented in each frame to enable N short global pixel-specific subexposures within one frame. To make these subexposures global, two latches per pixel are utilized in a pipelined fashion. The code for the next subframe is loaded into latch 1 in a row parallel fashion, while the code for the current subframe is being applied by latch 2 globally for photo-generated charge sorting during the current subexposure. A 280 H × 176V image sensor prototype with 11 .2-µm pixel pitch has been fabricated in a 0 .11-µm CMOS image sensor (CIS) technology. The image sensor has been demonstrated in two computational photography applications, each using only a single frame of a video: 1) computing both Manuscript received April 25, 2019; revised July 2, 2019; accepted July 20, 2019. Date of publication September 18, 2019; date of current version October 23, 2019. This article was approved by Associate Editor Vivek De. This work was supported in part by the Natural Sciences and Engineering Research Council of Canada under RGP IN, RTI, and SGP programs, in part by DARPA under REVEAL Program, and in part by CMC Microsystems. (Corresponding author: Navid Sarhangnejad.) N. Sar