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JSSC 2019第11期RF & WirelessOptical I/O

RADAR and wireless communications and it is also possible to realize the same co

硅光子技术进步推动低成本光学相控阵(OPA)发展,但仍面临芯片集成挑战。
500–1000元件数量
硅光子技术光学相控阵低成本芯片集成SOI工艺
多芯片方法减少独立电信号数量
SOI工艺实现电子与光子单片集成
单芯片解决方案降低I/O和电子密度问题
Abstract
as gained a lot of attention alongside advancements in silicon photonics technology, w hich enables inexpensive fabrication of a large number of optical components [10], [11]. OPA technology has progressed tremendously within a rela- tively short period of time, and multiple large-scale implemen- tations with ∼1000 elements recently reported [12]–[16]. However, it is still challenging to realize a low-cost OPA that can bring the proliferatio n of chip-scale optical beam scanners to mass markets.