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JSSC 2020第9期Clocking & PLLs65nm

A 0.46-THz 25-Element Scalable and Wideband Radiator Array With Optimized Lens Integration in 65-nm CMOS

本文提出了一种438–479GHz全集成25元件辐射器阵列,采用可扩展耦合结构,优化透镜提升辐射性能。
65nm CMOS, 1.2V, 40.7GHz/8.9%调谐范围, 19.3dBm EIRP
太赫兹辐射器阵列硅透镜频率调谐EIRP
创新点1:可扩展耦合结构 - 提出了一种基于耦合驻波振荡器单元的可扩展结构,避免了传统耦合网络带来的额外损耗和寄生效应,实现了25个辐射单元的高效集成,显著提升了阵列的辐射功率和效率。
创新点2:无变容二极管频率调谐方法 - 采用了一种无需变容二极管的频率调谐技术,扩展了工作带宽(40.7 GHz/8.9%),同时避免了变容二极管引入的非线性和损耗问题,提升了频率调谐的线性度和稳定性。
创新点3:硅透镜优化辐射方向性 - 通过优化硅透镜与芯片的辐射配置,最大化辐射方向性,实现了19.3-dBm的等效全向辐射功率(EIRP)和-1.8-dBm的辐射功率,显著提升了系统的辐射性能。
创新点4:高集成度与低相位噪声 - 在65-nm CMOS工艺下实现了全集成设计,同时达到了-100.6 dBc/Hz的相位噪声(10-MHz偏移),在350 GHz以上频段展现了优异的噪声性能和集成度。
Abstract
In this article, we present a 438–479-GHz fully integrated 25-element radiator array source based on a scalable structure of coupled standing wave oscillator cells without extra loss and parasitics from coupling networks. The bandwidth is extended using a varactor-less frequency tuning method, and EIRP is improved by increasing the size of the array using the proposed scalable coupling method and maximizing the radiation directivity using a silicon lens in an optimized radiation setup. An analysis of the radiation directivity of a chip-lens setup is presented as well as the employed approach for enhancing EIRP by maximizing the directivity. The circuit is implemented in a 65-nm CMOS process and is measured to have 40.7 GHz/8.9% frequency tuning range. The chip consumes 0.38–2.34-W power (1.18 W at 459-GHz center frequency) from a 1.2-V s upply voltage. The circuit provides a maximum of −1.8-dBm radiated power and 19.3-dBm EIRP at 448 GHz using a 12.5-mm radius silicon lens. The minimum measured phase noise at 10-MHz offset is −100.6 dBc/Hz. To the best of our knowledge, this article has the largest EIRP, radiated power , and bandwidth among fully integrated silicon-based coherent sources above 350 GHz.