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First Demonstration of Distributed Amplifier MMICs With More Than 300-GHz Bandwidth Fabian Thome and
首次展示带宽超过300GHz的分布式放大器MMIC。
带宽>300GHz, 噪声系数2-10dB, 输出功率8.7-14.8dBm
分布式放大器MMIC带宽噪声系数输出功率
▸首次实现带宽超过300GHz的分布式放大器MMIC
▸研究了栅极线与晶体管连接对性能的影响
▸展示了短连接在带宽、输入匹配和损耗方面的优势
Abstract
This article reports on the first demonstration of distributed amplifier monolithic microwave integrated circuits (MMICs) with a bandwidth (BW) of more than 300 GHz. The three presented circuits utilize a uniform traveling-wave amplifier topology with six, eight, and ten unit cells, respectively. In this article, the impact of the connection between the gate line and the transistors on the achievable performance is investigated. It is demonstrated that a short connection clearly provides a more favorable combination of BW, input matching, and losses on the gate line. Thus, it is possible to extend the BW beyond 300 GHz while utilizing transistors with a gate width of 2 × 10 µm. The MMICs are fabricated in a 35-nm gate-length InGaAs metamorphic high-electron-mobility transistor technology. The MMIC with six unit cells exhibits a noise figure (NF) between 3.5 and 8.2 dB for a noise-optimized bias from 1 GHz up to the measurement limit of 308 GHz. The MMIC with ten unit cells achieves a minimum NF of 2 dB for frequencies of around 50 GHz and stays below 10 dB for the entire band. Furthermore, for a power-optimized bias, the same circuit generates an output power between 8.7 and 14.8 dBm for a frequency range from 1 to 250 GHz.