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JSSC 2021第9期Memory28nmSRAM

Two-Direction In-Memory Computing Based on 10T SRAM With Horizontal and Vertical Decoupled

提出一种基于10T SRAM的双向内存计算架构,消除垂直数据存储需求并提升计算稳定性。
28nm CMOS工艺,0.9V电压,读裕度达传统6T SRAM的3倍
内存计算10T SRAM并行处理内容寻址存储器低功耗设计
采用十字形字线布局实现多行/多列并行激活的向量逻辑运算
新型水平读取通道支持矩阵转置操作
自终止结构降低38.5%搜索能耗(0.9V TT工艺角)
Abstract
In-memory computing establishes a new and promising computing paradigm aimed at solving problems caused by the von Neumann bottleneck. It eliminates the need for frequent data transfer between the memory and processing modules and enables the parallel activation of multiple lines. However, vertical data storage is generally required, increasing the implementation complexity for the SRAM writing mode. This article proposes a 10-transistor (10T) SRAM to omit vertical data storage and improve the stability of in-memory computing. A cross-layout of the word line enables arrays with multirow or multicolumn parallel activation to perform vector logic operations in two directions. In addition, the novel horizon- tal read channel allows matrix transposition. By reconfiguring the data lines, sense amplifiers, and multiplexing read ports, the proposed SRAM can be regarded as a content-addressable memory (CAM), and its symmetry provides selectable data search by column or by row according to the application that easily fits the SRAM storage mode without additional data adjustments. A proposed self-termination structure aims to decrease search energy consumption by approximately 38.5% at 0.9 V at the TT process corner. To verify the effectiveness of the proposed design, a 4 Kb SRAM was implemented in 28-nm CMOS technology. The read margin of the proposed 10T SRAM cell is three times higher than that of the conventional 6-transistor cell. At 0.9 V , logic operations can be performed at appro