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A 670-GHz 4 × 2 Oscillator–Radiator Array Achieving 7.4-dBm EIRP in 40-nm CMOS Gabriel Guimarães
40纳米CMOS工艺实现的670GHz太赫兹源阵列,采用第三谐波振荡器-辐射器拓扑,最大EIRP达7.4dBm。
660.8–676.6 GHz可调范围,7.4 dBm EIRP,-16.1 dBm辐射功率,99.7 mW功耗
太赫兹源CMOS振荡器阵列谐波辐射超半球透镜
▸第三谐波振荡器-辐射器拓扑
▸滤波反馈网络避免负载效应
▸共模和差模耦合机制的4×2振荡器单元阵列
Abstract
A 670-GHz terahertz source array is implemented in 40-nm bulk CMOS technology. To increase the frequency and power of the source, a compact and 1-D scalable oscillator–radiator topology that works on the third harmonic is proposed. In order to avoid the gate transistor node from loading the tank at the output frequency, a filtering feedback network is used to feed through the fundamental signal while filtering the third harmonic. The source consists of 4 × 2 oscillator cells with different common- and differential-mode coupling mechanisms that are built into the slotline resonant tanks. These slotlines build up an E-field pattern that radiates the signal to the far-field. The chip is assembled on a hyperhemispherical lens that suppresses substrate modes and further increases the directivity of the source. The full array and pads have a die size of 0.75×1.15 mm 2. The source can be tuned in the range of 660.8–676.6 GHz. It has a maximum measured EIRP of 7.4 dBm and −16.1 dBm radiated output power while consuming only 99.7 mW. The source also has a measured phase noise at 1- and 10-MHz offsets of −69 and −93 dBc/Hz, respectively.