← 返回 JSSC 论文列表JSSC 2022第3期Other
Guest Editorial 2021 Custom Integrated Circuits Conference T HIS Special Section
2021年定制集成电路会议（CICC）特别专栏，展示虚拟会议中的前沿技术与教育成果。
无
定制集成电路虚拟会议教育课程全球参与IEEE JSSC
▸创新点1：虚拟会议形式（方法创新）- 采用完全虚拟的会议形式，利用前一年的经验和技术积累，确保会议流程顺畅，提高了全球参与者的可访问性，特别是在COVID-19疫情期间。
▸创新点2：免费教育课程（系统创新）- 提供免费的周日教程课程，显著降低了学习门槛，吸引了更多来自南美和非洲等地区的参与者，促进了知识的广泛传播。
▸创新点3：全球参与激励（方法创新）- 通过极低的注册费用（仅20美元）激励非演讲学生参与，无论是否为IEEE会员，显著增加了虚拟参会人数，特别是来自经济欠发达地区的参与者。
▸创新点4：高质量文章扩展（技术贡献）- 从会议中精选17篇高质量文章进行扩展，提供更深入的概念、想法和测试结果展示，推动了IC设计领域的技术交流与进步。
Abstract
SC) features expanded ver-
sions of key articles presented at the 2021 Custom Integrated
Circuits Conference (CICC), which for the second time in
a row was fully virtual due to the coronavirus pandemic.
Originally planned to be held in Austin, TX, USA, the
unpredictability of COVID-19 quickly lead the conference
organization to decide to (again) go for a fully virtual format
from April 25 to 30, 2021. With all the experience of the
previous year, where CICC was the first IEEE Solid-State
Circuits