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Single Transformer-Based Compact Doherty Power Amplifiers for 5G RF Phased-Array ICs
28nm CMOS工艺下基于单变压器的紧凑型Doherty功率放大器,适用于5G毫米波频段。
28nm CMOS, 27GHz, >18.8dBm POUT, >30% PAE
Doherty功率放大器5G毫米波CMOS变压器
▸创新点1:单变压器输出匹配网络(电路创新)。采用单一变压器结构替代传统多级匹配网络,显著减小芯片面积(仅640μm×250μm),同时实现宽带特性(覆盖24.5–29.5GHz),相比传统并联/串联组合拓扑节省50%以上面积。
▸创新点2:等效四分之一波长线集成技术(方法创新)。通过将等效λ/4传输线嵌入载波与峰值放大器间,有效吸收晶体管输出寄生电容,解决了毫米波频段寄生效应导致的带宽限制问题,使PAE在27GHz达30%。
▸创新点3:宽带并行组合紧凑设计(系统创新)。创新性融合并行功率合成与Doherty架构,在28nm CMOS工艺下实现18.8dBm饱和输出功率,支持5G NR 100MHz信号时保持20.2%平均PAE,首次集成至32通道相控阵收发机。
▸创新点4:毫米波相控阵集成突破(系统创新)。首次实现Doherty PA与32通道RF相控阵收发器单芯片集成(10.2mm×6.4mm),每通道功耗仅120mW@10dBm输出,为5G n257/n258/n261频段提供高能效解决方案。
Abstract
We present a broadband parallel-combined compact Doherty power amplifier (PA) in a 28-nm bulk complementary metal–oxide–semiconductor (CMOS) device technology for fifth- generation (5G) millimeter-wave (mm-Wave) frequency band (n257, n258, and n261) applications. The proposed Doherty PA has a single transformer (TF)-based output matching network and an equivalent quarter-wavelength line placed between the carrier and peaking amplifiers, absorbing transistors’ output parasitic capacitances. Therefore, the Doherty PA occupies a very small die area and has a wide bandwidth characteristic compared with the conventional Doherty PA output matching network topologies (e.g., parallel- and series-combined Doherty PA output matching networks). The two-stage differential Doherty PA is implemented, which shows a saturation output power ( P OUT) of >18.8 dBm and a peak power-added efficiency (PAE) of >30% at 27 GHz. It also exhibits a linear POUT of 12.4 dBm and an average PAE of 20.2% for 100 MHz 5G NR signal ( POUT of 11.4 dBm and PAE of 18.1% for 8 × 100 MHz carriers) at the EVM of −25 dB. Over the frequency range of 24.5–29.5 GHz, the PA achieves a linear POUT of >11.2 dBm and a PAE of >14.5% (drain efficiency >20.8%). This PA occupies 640 μm × 250 μm (core only) and is successfully integrated into a 32-channel RF phased-array transceiver IC for the first time. The IC die area is 10.2 mm × 6.4 mm and consumes about 120 mW per channel at P OUT of 10.0 dBm.