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Guest Editorial Introduction to the Special Issue on the 2022 IEEE International
2022 IEEE ISSCC精选论文特刊介绍，涵盖数字架构、机器学习、存储器及有线通信等领域。
5 nm FinFET, 224 Gb/s, 38 dBs loss equalization
有线通信ADC-DSP模拟混合信号5nm FinFET高能效
▸100+ Gb/s带宽的高能效有线通信技术
▸ADC-DSP解决方案实现224 Gb/s数据速率
▸模拟混合信号均衡技术替代ADC-DSP
Abstract
rnational Technical Program Committee (ITPC)
of the IEEE International Solid-State Circuits Conference
(ISSCC) selects outstanding articles from the papers presented
at the conference and invites the authors to submit an extended
manuscript to the special issue of IEEE J
OURNAL OF SOLID -
STATE CIRCUITS (JSSC). This January issue contains the
selected papers from the Digita l Architectures and Systems,
Digital Circuits, Machine Learning, Memory, and Wireline
subcommittees.
I. W
IRELINE
The wirel