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JSSC 2023第4期Image SensorsBSI工艺CMOS Image Sensor

A Hybrid ToF Image Sensor for Long-Range 3D Depth Measurement Under High Ambient Light Conditions Kunihiro Hatakeyama , Y u Okubo, Tomohiro Nakagome, Masahiro Makino, Hiroshi Takashima

一种新型混合飞行时间传感器实现30米长距离3D深度测量,适用于高环境光条件。
VGA分辨率,4-tap和1-drain像素,120帧/秒(单子帧操作),室内30米/室外20米(100 klux环境光)
混合飞行时间长距离测距高环境光多时间窗口运动伪影抑制
混合ToF操作(hToF)结合多时间窗口和范围偏移子帧
重叠时间窗口减少运动伪影
发射周期变化技术抑制多ToF相机干扰
Abstract
A new indirect time of flight (iToF) sensor realizing long-range measurement of 30 m has been demonstrated by a hybrid ToF (hToF) operation, which uses multiple time windows (TWs) prepared by multi-tap pixels and range-shifted subframes. The VGA-resolution hToF image sensor with 4-tap and 1-drain pixels, fabricated by the BSI process, can measure a depth of up to 30 m for indoor operation and 20 m for outdoor operation under high ambient light of 100 klux. The new hToF operation with overlapped TWs between subframes for mitigating an issue on the motion artifact is implemented. The sensor works at 120 frames/s for a single subframe operation. Interference between multiple ToF cameras in IoT systems is suppressed by a technique of emission cycle-time changing.